参数资料
型号: SI5334B-A00123-GM
厂商: SILICON LABORATORIES
元件分类: 时钟及定时
英文描述: PLL BASED CLOCK DRIVER, QCC24
封装: 4 X 4 MM, ROHS COMPLIANT, MO-220VGGD-8, QFN-24
文件页数: 18/34页
文件大小: 233K
代理商: SI5334B-A00123-GM
Si5334
Preliminary Rev. 0.16
25
6. Recommended PCB Layout
Table 17. PCB Land Pattern
Dimension
Min
Nom
Max
P1
2.50
2.55
2.60
P2
2.50
2.55
2.60
X1
0.20
0.25
0.30
Y1
0.75
0.80
0.85
C1
3.90
C2
3.90
E0.50
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. Connect the center ground pad to a ground plane with no less than five vias to a ground plane that is no more than 20 mils
below it. Via drill size should be no smaller than 10 mils. A longer distance to the ground plane is allowed if more vias are used
to keep the inductance from increasing.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be
60 m minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste
release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
9. A 2x2 array of 1.0 mm square openings on 1.25 mm pitch should be used for the center ground pad.
Card Assembly
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
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