参数资料
型号: SI7222DN-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/14页
文件大小: 0K
描述: MOSFET N-CH D-S 40V 1212-8 PPAK
标准包装: 1
系列: TrenchFET®
FET 型: 2 个 N 沟道(双)
FET 特点: 标准
漏极至源极电压(Vdss): 40V
电流 - 连续漏极(Id) @ 25° C: 6A
开态Rds(最大)@ Id, Vgs @ 25° C: 42 毫欧 @ 5.7A,10V
Id 时的 Vgs(th)(最大): 1.6V @ 250µA
闸电荷(Qg) @ Vgs: 29nC @ 10V
输入电容 (Ciss) @ Vds: 700pF @ 20V
功率 - 最大: 17.8W
安装类型: 表面贴装
封装/外壳: PowerPAK? 1212-8 双
供应商设备封装: PowerPAK? 1212-8 Dual
包装: 标准包装
其它名称: SI7222DN-T1-GE3DKR
Si7222DN
Vishay Siliconix
Dual N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
40
R DS(on) ( Ω )
0.042 at V GS = 10 V
0.047 at V GS = 4.5 V
I D (A)
6 e
5 e
Q g (Typ.)
8 nC
? Halogen-free According to IEC 61249-2-21
Available
? TrenchFET ? Power MOSFET
? Low Thermal Resistance PowerPAK ?
Package with Small Size and Low 1.07 mm
Profile
APPLICATIONS
PowerPAK 1212-8
? Primary Side Switch
? Synchronus Rectification
3.30 mm
1
S1
G1
3.30 mm
D 1
D 2
2
3
S2
4
G2
8
D1
D1
G 1
G 2
7
6
D2
5
D2
Bottom View
S 1
S 2
Ordering Information: Si7222DN-T1-E3 (Lead (Pb)-free)
Si7222DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
40
± 12
6 e
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
5 e
5.7 a, b
Pulsed Drain Current
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
4.3 a, b
24
6 e
2.0 a, b
13
8.5
A
mJ
T C = 25 °C
17.8
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
11.4
2.5 a, b
W
T A = 70 °C
1.6 a, b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) c, d
T J , T stg
- 55 to 150
260
°C
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Package limited.
Document Number: 73439
S-83052-Rev. B, 29-Dec-08
www.vishay.com
1
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