参数资料
型号: SI7636DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH D-S 30V PPAK 8SOIC
标准包装: 3,000
系列: TrenchFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 17A
开态Rds(最大)@ Id, Vgs @ 25° C: 4 毫欧 @ 25A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 50nC @ 4.5V
输入电容 (Ciss) @ Vds: 5600pF @ 15V
功率 - 最大: 1.9W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 带卷 (TR)
Si7636DP
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
30
R DS(on) ( Ω )
0.004 at V GS = 10 V
0.0048 at V GS = 4.5 V
I D (A)
28
25
Q g (Typ.)
36
? Halogen-free According to IEC 61249-2-21
Available
? Ultra-Low On-Resistance Using High Density
TrenchFET ? Gen II Power MOSFET Technology
? Q g Optimized
? New Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
? 100 % R g Tested
PowerPAK SO-8
APPLICATIONS
?
Low-Side DC/DC Conversion
- Notebook
6.15 mm
1
S
2
S
3
S
5.15 mm
G
4
- Server
- Workstation
? Synchronous Rectifier, POL
D
D
8
7
D
D
6
D
5
Bottom V ie w
G
Ordering Information: Si7636DP-T1-E3 (Lead (Pb)-free)
Si7636DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
30
± 20
Unit
V
Continuous Drain Current (T J = 150 °C) a
Pulsed Drain Current (10 μs Pulse Width)
Continuous Source Current (Diode Conduction) a
Avalanche Current
T A = 25 °C
T A = 70 °C
L = 0.1 mH
I D
I DM
I S
I AS
28
22
4.3
60
50
17
13
1.7
A
Maximum Power Dissipation a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b,c
T A = 25 °C
T A = 70 °C
P D
T J , T stg
5.2
3.3
- 55 to 150
260
1.9
1.2
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
a
t ≤ 10 s
Steady State
R thJA
19
52
24
65
°C/W
Maximum Junction-to-Case (Drain)
Steady State
R thJC
1.3
1.8
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( http://www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 72768
S09-0272-Rev. G, 16-Feb-09
www.vishay.com
1
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