参数资料
型号: SI7726DN-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/14页
文件大小: 0K
描述: MOSFET N-CH 30V 35A 1212-8
产品目录绘图: DN-T1-E3 Series 1212-8
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 35A
开态Rds(最大)@ Id, Vgs @ 25° C: 9.5 毫欧 @ 10A,10V
Id 时的 Vgs(th)(最大): 2.6V @ 250µA
闸电荷(Qg) @ Vgs: 43nC @ 10V
输入电容 (Ciss) @ Vds: 1765pF @ 15V
功率 - 最大: 52W
安装类型: 表面贴装
封装/外壳: PowerPAK? 1212-8
供应商设备封装: PowerPAK? 1212-8
包装: 标准包装
产品目录页面: 1660 (CN2011-ZH PDF)
其它名称: SI7726DN-T1-GE3DKR
Si7726DN
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
FEATURES
V DS (V)
30
R DS(on) ( Ω )
0.0095 at V GS = 10 V
0.0125 at V GS = 4.5 V
I D (A) e
35
35
Q g (Typ.)
12.5 nC
? Halogen-free
? SkyFET Monolithic TrenchFET ? Power
MOSFET and Schottky Diode
? Low Thermal Resistance PowerPAK ?
RoHS
COMPLIANT
Package with Small Size and Low 1.07 mm Profile
? 100 % R g Tested
PowerPAK 1212-8
APPLICATIONS
? DC/DC Converter
3.30 mm
1
S
2
S
3
S
3.30 mm
G
- Notebook
- POL
D
4
D
8
7
D
D
6
5
D
G
Schottky Diode
Bottom V ie w
Orderin g Information: Si7726D N -T1-GE3 (Lead (P b )-free and Halogen-free)
N -Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
30
± 20
35 e
Unit
V
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
I D
I DM
I S
35 e
14.9 a, b
11.8 a, b
60
35 e
5.4 a, b
A
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I AS
E AS
20
20
mJ
T C = 25 °C
52
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
33
3.8 a, b
W
T A = 70 °C
2.4 a, b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) c, d
T J , T stg
- 50 to 150
260
°C
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See Solder Profile ( h ttp://www.vishay.com/ppg?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Package limited.
Document Number: 68600
S-81737-Rev. B, 04-Aug-08
www.vishay.com
1
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