参数资料
型号: SI7802DN-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/12页
文件大小: 0K
描述: MOSFET N-CH 250V 1.24A 1212-8
产品目录绘图: DN-T1-E3 Series 1212-8
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 250V
电流 - 连续漏极(Id) @ 25° C: 1.24A
开态Rds(最大)@ Id, Vgs @ 25° C: 435 毫欧 @ 1.95A,10V
Id 时的 Vgs(th)(最大): 3.6V @ 250µA
闸电荷(Qg) @ Vgs: 21nC @ 10V
功率 - 最大: 1.5W
安装类型: 表面贴装
封装/外壳: PowerPAK? 1212-8
供应商设备封装: PowerPAK? 1212-8
包装: 标准包装
产品目录页面: 1660 (CN2011-ZH PDF)
其它名称: SI7802DN-T1-GE3DKR
Si7802DN
Vishay Siliconix
N-Channel 250-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
250
R DS(on) ( Ω )
0.435 at V GS = 10 V
0.445 at V GS = 6 V
I D (A)
1.95
1.9
? Halogen-free According to IEC 61249-2-21
Available
? PWM-Optimized TrenchFET ? Power MOSFET
? Avalanche Tested
? 100 % R g Tested
APPLICATIONS
PowerPAK ? 1212-8
? Primary Side Switch
? Small DC/DC Circuits
? Single-Ended Primary Switching Circuits
3.30 mm
1
S
2
S
S
3.30 mm
D
D
3
4
G
8
D
7
6
D
D
G
5
Bottom View
Ordering Information: Si7802DN-T1-E3 (Lead (Pb)-free)
Si7802DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
250
± 20
Unit
V
Continuous Source Current (Diode Conduction)
Continuous Drain Current (T J = 150 °C) a
Pulsed Drain Current
Single Avalanche Current
Single Avalanche Energy
a
T A = 25 °C
T A = 70 °C
L = 0.1 mH
I D
I DM
I S
I AS
E AS
1.95
1.56
3.2
8
2.5
0.3
1.24
0.99
1.3
A
mJ
Maximum Power Dissipation a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b, c
T A = 25 °C
T A = 70 °C
P D
T J , T stg
3.8
2.0
- 55 to 150
260
1.5
0.8
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient a
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Steady State
R thJA
R thJC
26
65
1.9
33
81
2.4
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73133
S-83050-Rev. D, 29-Dec-08
www.vishay.com
1
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