参数资料
型号: SI7846DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH D-S 150V PPAK 8SOIC
标准包装: 3,000
系列: TrenchFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 150V
电流 - 连续漏极(Id) @ 25° C: 4A
开态Rds(最大)@ Id, Vgs @ 25° C: 50 毫欧 @ 5A,10V
Id 时的 Vgs(th)(最大): 4.5V @ 250µA
闸电荷(Qg) @ Vgs: 36nC @ 10V
功率 - 最大: 1.9W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 带卷 (TR)
Si7846DP
Vishay Siliconix
N-Channel 150-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
150
R DS(on) ( Ω )
0.050 at V GS = 10 V
I D (A)
6.7
? Halogen-free According to IEC 61249-2-21
Definition
? TrenchFET ? Power MOSFETS
? New Low Thermal Resistance PowerPAK ?
Package with Low 1.07 mm Profile
? PWM Optimized for Fast Switching
? 100 % R g Tested
PowerPAK SO-8
APPLICATIONS
? Primary Side Switch for High Density DC/DC
6.15 mm
1
S
S
5.15 mm
? Telecom/Server 48 V DC/DC
? Industrial and 42 V Automotive
2
S
3
4
G
D
D
8
7
D
D
6
5
D
G
Bottom View
S
Ordering Information: Si7846DP-T1-E3 (Lead (Pb)-free)
Si7846DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
150
± 20
Unit
V
T C = 25 °C
24.5
Continuous Drain Current (T J = 150 °C) a
T C = 70 °C
T A = 25 °C
T A = 70 °C
I D
6.7
5.4
19.5
4.0
3.3
A
Pulsed Drain Current
I DM
50
Avalanche Current
L = 0.1 mH
I AS
25
Continuous Source Current (Diode Conduction)
a
I S
4.3
1.6
Maximum Power Dissipation a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b, c
T A = 25 °C
T A = 70 °C
P D
T J , T stg
5.2
3.3
- 55 to 150
260
1.9
1.2
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
a
t ≤ 10 s
Steady State
R thJA
19
52
24
65
°C/W
Maximum Junction-to-Case (Drain)
Steady State
R thJC
1.5
1.8
Notes
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71442
S09-0537-Rev. F, 06-Apr-09
www.vishay.com
1
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