参数资料
型号: SIRA04DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET N-CHAN 30V(D-S)POWERPAK
标准包装: 1
系列: TrenchFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 40A
开态Rds(最大)@ Id, Vgs @ 25° C: 2.15 毫欧 @ 15A,10V
Id 时的 Vgs(th)(最大): 2.2V @ 250µA
闸电荷(Qg) @ Vgs: 77nC @ 10V
输入电容 (Ciss) @ Vds: 3595pF @ 15V
功率 - 最大: 27.7W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 标准包装
其它名称: SIRA04DP-T1-GE3DKR
New Product
SiRA04DP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( ? ) (Max.)
I D (A) a, g
Q g (Typ.)
FEATURES
? TrenchFET ? Gen IV Power MOSFET
? 100 % R g and UIS Tested
30
0.00215 at V GS = 10 V
0.00310 at V GS = 4.5 V
40
40
22.5 nC
? Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
PowerPAK ? SO-8
APPLICATIONS
? Synchronous Rectification
? High Power Density DC/DC
D
6.15 mm
1
S
S
5.15 mm
? VRMs and Embedded DC/DC
2
S
8
D
D
3
4
G
G
7
6
D
5
D
Bottom View
S
N-Channel MOSFET
Ordering Information:
SiRA04DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
30
+ 20, - 16
40 g
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
40 g
35.9 b, c
Pulsed Drain Current (t = 300 μs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = ? 0.1 mH
I DM
I S
I AS
E AS
28.7 b, c
80
40 g
4.5 b, c
20
20
A
mJ
T C = 25 °C
62.5
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
40
5 b, c
W
T A = 70 °C
3.2 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t ? 10 s
Steady State
R thJA
R thJC
20
1.6
25
2
°C/W
Notes:
a. Based on T C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile ( www.vishay.com/doc?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
Document Number: 63725
S12-2118-Rev. B, 03-Sep-12
For technical questions, contact: pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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