参数资料
型号: SIS412DN-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/13页
文件大小: 0K
描述: MOSFET N-CH D-S 30V 1212-8 PPAK
标准包装: 1
系列: TrenchFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 12A
开态Rds(最大)@ Id, Vgs @ 25° C: 24 毫欧 @ 7.8A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 12nC @ 10V
输入电容 (Ciss) @ Vds: 435pF @ 15V
功率 - 最大: 15.6W
安装类型: 表面贴装
封装/外壳: PowerPAK? 1212-8
供应商设备封装: PowerPAK? 1212-8
包装: 标准包装
其它名称: SIS412DN-T1-GE3DKR
New Product
SiS412DN
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
30
R DS(on) ( Ω )
0.024 at V GS = 10 V
0.030 at V GS = 4.5 V
I D (A) a
12
12
Q g (Typ.)
3.8 nC
? Halogen-free According to IEC 61249-2-21
? TrenchFET ? Power MOSFET
? 100 % R g Tested
PowerPAK 1212-8
APPLICATIONS
? Notebook PC
- System Power
3.30 mm
1
S
S
3.30 mm
- Load Switch
D
2
3
S
G
4
D
8
7
D
6
D
5
D
G
Bottom V ie w
Orderin g Information: SiS412D N -T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S
N -Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
30
± 20
12 a
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
12 a
8.7 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
7 b, c
30
12 a
2.7 b, c
5
1.25
A
mJ
T C = 25 °C
15.6
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
10
3.2 b, c
W
T A = 70 °C
2 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) e, f
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient b, d
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
R thJA
R thJC
32
6.5
39
8
°C/W
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 81 °C/W.
e. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 69006
S09-0135-Rev. C, 02-Feb-09
www.vishay.com
1
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