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参数资料
| 型号： | SKY77324 |
| 厂商： | SKYWORKS SOLUTIONS INC |
| 元件分类： | 放大器 |
| 英文描述： | iPAC PAM for Quad-Band GSM / GPRS |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封装： | 6 X 6 MM, 1.2MM HEIGHT, LEAD FREE, LEADLESS PACKAGE-22 |
| 文件页数： | 7/23页 |
| 文件大小： | 1218K |
| 代理商： | SKY77324 |
iPAC PA MODULE FOR QUAD-BAND GSM / GPRS
DATA SHEET SKY77324
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
103123D Skyworks Proprietary and Confidential information. Products and product information are subject to change without notice. June 9, 2005
15
Figure 5. SKY77324 PAM Pin Configuration—22-Pin Leadless
(Top View)
Table 4. SKY77324 Pin Names and Signal Descriptions
Pin
Name
Description
1
VCC1C
VCC (to PAC)
2
PAC ENABLE
Closed loop PAC mode CMOS enable
3
VCC1A
VCC (to GSM 1st stage, DCS 1st stages)
4
BS
Band Select
5
DCS/PCS_IN
RF input 1710–1910 MHz
6
GSM_IN
RF input 824–915 MHz
7
GND
RF and DC Ground
8
VCC1B
VCC (to GSM 2nd stage, DCS 2nd stage)
9-11
GND
RF and DC Ground
12
GSM_OUT
RF Output 824–915 MHz
13-14
GND
RF and DC Ground
15
RSVD
Reserved
16
GND
RF and DC Ground
17
DCS/PCS_OUT RF Output 1710–1910 MHz
18
GND
RF and DC Ground
19
VSENSE
Voltage output of low side of internal sense resistor
(DO NOT CONNECT IN CLOSED LOOP MODE.)
20
VBATT
Battery input to high side of internal sense resistor
21
GND
RF and DC Ground
22
VAPC
Power Control Bias Voltage
GROUND
PAD
GND
Ground Pad, device underside
Figure 6. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77324 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature should
not exceed 250 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to
temperatures exceeding 250 °C for more than 10 seconds.
For details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
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相关代理商/技术参数 |
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|---|---|
| SKY77325 | 制造商:SKYWORKS 制造商全称:SKYWORKS 功能描述:iPAC⑩ PAM for Quad-Band GSM / GPRS |
| SKY77325-12 | 制造商:Skyworks Solutions Inc 功能描述:Part Number Only |
| SKY77328 | 制造商:SKYWORKS 制造商全称:SKYWORKS 功能描述:iPAC PAM for Quad-Band GSM/GPRS |
| SKY77331 | 制造商:SKYWORKS 制造商全称:SKYWORKS 功能描述:Power Amplifier Module with Integrated Coupler for Quad-Band GSM / EDGE |
| SKY77336 | 制造商:SKYWORKS 制造商全称:SKYWORKS 功能描述:Power Amplifier Module for Quad-Band GSM/GPRS/EDGE |
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