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参数资料
| 型号： | SL1ICS3101 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | I.CODE1 Label IC 97pF Chip Specification |
| 中文描述： | I.CODE1标签IC 97pF芯片规格 |
| 文件页数： | 5/22页 |
| 文件大小： | 373K |
| 代理商： | SL1ICS3101 |
Product Specification
SL1 ICS31 01
Rev. 1.2
July 2000
Page 5 of 22
Public
3 Scope
This specification describes the electrical, physical and dimensional properties of unsawn and sawn
wafers on FFC of ICODE1 Label ICs (C
res
= 97 pF) on a Philips 6C15 IDFW process and is the
base for delivery of tested ICODE1 Label ICs.
General recommendations are given for storage, handling and processing of wafers as well as
assembly of labels.
Reference documents:
MIL-STD 883D Method 3023
MIL-STD 883D Method 3015
SNW-FQ-627
PICTOH-QS007
General Specification for 6” Wafer
General Quality Specification
ICODE Label IC, Coil Design Guide
This product specification is valid for mask revision: VCOL1V0 NK: O MB: B
4 Ordering Information
Following ordering options are available:
Type Name
SL1 ICS31 01W/N5D
SL1 ICS31 01U/N5D
SL1 ICS31 01U/L6D
Description
Sawn wafer on foil (FFC), 150 μm, inked and mapped
Unsawn wafer, 150 μm, inked and mapped
Unsawn wafer, 525 μm, mapped (
not
inked)
Ordering Code
9352 670 53005
9352 670 50025
9352 670 59025
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PDF描述 |
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| SL1ICS3101U | I.CODE1 Label IC 97pF Chip Specification |
| SL2055 | PREAMPLIFIER FOR REMOTE CONTROL USE |
| SL3ICS30 | UCODE HSL |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SL1ICS3101U | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101U/L6D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101U/N5D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101W | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101W/N4D | 功能描述:接口 - 专用 ICODE 1 HC FFC RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
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