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参数资料
| 型号： | SMJ320C40KGDM40CT |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 数字信号处理 |
| 英文描述： | 32-BIT, 40 MHz, OTHER DSP, UUC325 |
| 封装： | DIE-325 |
| 文件页数： | 10/14页 |
| 文件大小： | 194K |
| 代理商： | SMJ320C40KGDM40CT |
SMJ320C40KGDD
FLOATINGPOINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS052 APRIL 2004
5
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
320C40 (rev 7.0) known good die pad information
325
244
Die Side Number 4
Pad Number One
1
Die Side Number 1
81
Zero-Zero
(origin)
82
162
Die Side Number 2
243
Die Side Number 3
163
Die Designator
Figure 2. 320C40 Die Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
D The C40 signal identities in relation to the pad numbers
D The C40 X, Y coordinates, where bond pad 82 serves as the origin (0,0)
In addition, the following notes are significant:
A.
X, Y coordinate data is in microns.
B.
The active silicon dimensions are 12 424.86
m × 12035.52 m (489.16 mils × 473.83 mils).
C.
The die size is approximately 12 598.40
m × 12192.00 m (496.00 mils × 480.00 mils).
D.
Bond pad dimensions are 108.00
m × 108.00 m (4.25 mils × 4.25 mils).
E.
Center of bond pad to edge of die min (without scribe) = 107.80
m (4.24 mils).
F.
For R-Tab devices, gold bump dimensions are approximately 92
m × 92 m (3.62 mils × 3.62 mils).
G.
Coordinate origin is at (0,0) (center of bond pad 82).
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