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参数资料
| 型号： | SMJ320C40KGDM40CT |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 数字信号处理 |
| 英文描述： | 32-BIT, 40 MHz, OTHER DSP, UUC325 |
| 封装： | DIE-325 |
| 文件页数： | 9/14页 |
| 文件大小： | 194K |
| 代理商： | SMJ320C40KGDM40CT |
SMJ320C40KGDD
FLOATINGPOINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS052 APRIL 2004
4
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
SMJ
320
C
40
M
KGD
50
PREFIX
SMJ =
MIL-PRF-38535 Processing
TMP =
Commercial Level
DEVICE FAMILY
320 = DSP Family
TECHNOLOGY
C = CMOS
DEVICE
40 = Floating-Point DSP
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
PACKAGE TYPE
KGD = Known Good Die
TEMPERATURE RANGE
M (Military)
=
55
°C to 125°C
L (Commercial) =
0
°Cto 70°C
C
DIE REVISION
C
= Revision 5.2
D
= Revision 7.0
T
KGD OPTION
T
= TWB process
blank = HCP
Figure 1. TMP / SMJ320C40KGD Device Nomenclature
JEDEC STANDARD
D Die thickness is approximately 15 mils ± 1 mil.
D Backside surface finish is silicon.
D Maximum allowable die junction operating temperature is 175°C.
D Glassivation material is compressive nitride.
D Bond pad metal is composed of copper-doped aluminum.
D Percent defective allowed for burned-in die is 5.
D Life test data is available.
D Configuration control notification.
D Group A attribute summary is available (SMJ only).
D Suggested die-attach material is silver glass (QMI 2569F).
D Suggested bond wire size is 1.25 mil.
D ESD rating is Class II.
D Maximum allowable peak process temperature for die-attach is 440°C ± 5°C (for QMS2569F)
D Saw kerf is dependent on blade size used.
D Die backside potential is left floating.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SMJ320C40TABM40 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Digital Signal Processor |
| SMJ320C40TABM40/10 | 制造商:TI 制造商全称:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS |
| SMJ320C40TABM50 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Digital Signal Processor |
| SMJ320C40TABM50/10 | 制造商:TI 制造商全称:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS |
| SMJ320C40TABS60 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Digital Signal Processor |
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