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参数资料
| 型号： | SN65LVDT390DRG4 |
| 厂商： | Texas Instruments, Inc. |
| 英文描述： | HIGH-SPEED DIFFERENTIAL LINE RECEIVERS |
| 中文描述： | 高速差分线路接收器 |
| 文件页数： | 15/21页 |
| 文件大小： | 404K |
| 代理商： | SN65LVDT390DRG4 |
Orderable Device
Status
(1)
Package
Type
TSSOP
Package
Drawing
DGG
Pins Package
Qty
2000 Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
50
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN75LVDT386DGGRG4
ACTIVE
64
CU NIPDAU
Level-2-260C-1 YEAR
SN75LVDT388ADBT
ACTIVE
SM8
DBT
38
CU NIPDAU
Level-2-260C-1 YEAR
SN75LVDT388ADBTG4
ACTIVE
SM8
DBT
38
CU NIPDAU
Level-2-260C-1 YEAR
SN75LVDT388ADBTR
ACTIVE
SM8
DBT
38
CU NIPDAU
Level-2-260C-1 YEAR
SN75LVDT388ADBTRG4
ACTIVE
SM8
DBT
38
CU NIPDAU
Level-2-260C-1 YEAR
SN75LVDT390D
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDT390DR
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDT390DRG4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDT390PW
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDT390PWG4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDT390PWR
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN75LVDT390PWRG4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
Addendum-Page 3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SN65LVDT390PW | 功能描述:LVDS 接口集成电路 HS Diff RoHS:否 制造商:Texas Instruments 激励器数量:4 接收机数量:4 数据速率:155.5 Mbps 工作电源电压:5 V 最大功率耗散:1025 mW 最大工作温度:+ 85 C 封装 / 箱体:SOIC-16 Narrow 封装:Reel |
| SN65LVDT390PWG4 | 功能描述:LVDS 接口集成电路 QUAD LVDS RECEIVER RoHS:否 制造商:Texas Instruments 激励器数量:4 接收机数量:4 数据速率:155.5 Mbps 工作电源电压:5 V 最大功率耗散:1025 mW 最大工作温度:+ 85 C 封装 / 箱体:SOIC-16 Narrow 封装:Reel |
| SN65LVDT390PWR | 功能描述:LVDS 接口集成电路 QUAD LVDS RECEIVER RoHS:否 制造商:Texas Instruments 激励器数量:4 接收机数量:4 数据速率:155.5 Mbps 工作电源电压:5 V 最大功率耗散:1025 mW 最大工作温度:+ 85 C 封装 / 箱体:SOIC-16 Narrow 封装:Reel |
| SN65LVDT390PWRG4 | 功能描述:LVDS 接口集成电路 QUAD LVDS RECEIVER RoHS:否 制造商:Texas Instruments 激励器数量:4 接收机数量:4 数据速率:155.5 Mbps 工作电源电压:5 V 最大功率耗散:1025 mW 最大工作温度:+ 85 C 封装 / 箱体:SOIC-16 Narrow 封装:Reel |
| SN65LVDT41PW | 功能描述:LVDS 接口集成电路 Interconnect Ext Chipset RoHS:否 制造商:Texas Instruments 激励器数量:4 接收机数量:4 数据速率:155.5 Mbps 工作电源电压:5 V 最大功率耗散:1025 mW 最大工作温度:+ 85 C 封装 / 箱体:SOIC-16 Narrow 封装:Reel |
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