参数资料
型号: SN74LVC1G08YEPR
厂商: TEXAS INSTRUMENTS INC
元件分类: 门电路
英文描述: LVC/LCX/Z SERIES, 2-INPUT AND GATE, PBGA5
封装: DSBGA-5
文件页数: 1/17页
文件大小: 562K
代理商: SN74LVC1G08YEPR
SN74LVC1G08
SINGLE 2INPUT POSITIVEAND GATE
SCES217S APRIL 1999 REVISED JUNE 2005
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 3.6 ns at 3.3 V
D Low Power Consumption, 10-A Max ICC
D ±24-mA Output Drive at 3.3 V
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
3
2
4
5
1
AVCC
Y
B
GND
DBV PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
5
1
AVCC
Y
B
GND
3
2
4
5
1
AVCC
Y
B
GND
A
GND
VCC
Y
B
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
1
4
2
3
5
description/ordering information
The SN74LVC1G08 performs the Boolean function Y
+ A Bor Y + A ) B in positive logic.
NanoStar
and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
NanoStar
WCSP (DSBGA)
0.17-mm Small Bump YEA
SN74LVC1G08YEAR
NanoFree
WCSP (DSBGA)
0.17-mm Small Bump YZA (Pb-free)
Reel of 3000
SN74LVC1G08YZAR
_ _ _CE_
NanoStar
WCSP (DSBGA)
0.23-mm Large Bump YEP
Reel of 3000
SN74LVC1G08YEPR
_ _ _CE_
40
°C to 85°C
NanoFree
WCSP (DSBGA)
0.23-mm Large Bump YZP (Pb-free)
SN74LVC1G08YZPR
SOT (SOT-23) DBV
Reel of 3000
SN74LVC1G08DBVR
C08_
SOT (SOT-23) DBV
Reel of 250
SN74LVC1G08DBVT
C08_
SOT (SC-70) DCK
Reel of 3000
SN74LVC1G08DCKR
SOT (SC-70) DCK
Reel of 250
SN74LVC1G08DCKT
CE_
SOT (SOT-553) DRL
Reel of 4000
SN74LVC1G08DRLR
CE_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
2005, Texas Instruments Incorporated
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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相关代理商/技术参数
参数描述
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SN74LVC1G10DBVRE4 功能描述:逻辑门 Sgl 3-Inp Pos-NAND Gate RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量(输入/输出):2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel