参数资料
型号: SN74LVC1G97YZAR
厂商: Texas Instruments, Inc.
英文描述: CONFIGURABLE MULTIPLE-FUNCTION GATE
中文描述: 可配置的多功能的门
文件页数: 1/17页
文件大小: 509K
代理商: SN74LVC1G97YZAR
www.ti.com
FEATURES
3
2
4
6
1
In1
In2
Y
GND
In0
DBV PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
6
1
In1
In2
Y
GND
In0
3
2
4
6
1
In1
In2
Y
GND
In0
In1
In0
In2
Y
V
CC
GND
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
1
4
2
3
6
V
CC
V
CC
V
CC
5
5
5
5
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to V
CC
or GND.
SN74LVC1G97
CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES416I–DECEMBER 2002–REVISED MARCH 2006
Available in the Texas Instruments
NanoStar and NanoFree Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 6.3 ns at 3.3 V
Low Power Consumption, 10-
μ
A Max I
CC
±24-mA Output Drive at 3.3 V
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Choose From Nine Specific Logic Functions
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
(2)
NanoStar – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-563) – DRL
SN74LVC1G97YEAR
SN74LVC1G97YZAR
Tape and reel
_ _ _CS_
SN74LVC1G97YEPR
–40°C to 85°C
SN74LVC1G97YZPR
Tape and reel
Tape and reel
Reel of 4000
SN74LVC1G97DBVR
SN74LVC1G97DCKR
SN74LVC1G97DRLR
C97_
CS_
CS_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
(2)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright 2002–2006, Texas Instruments Incorporated
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