参数资料
型号: SN75HVD1176DG4
厂商: TEXAS INSTRUMENTS INC
元件分类: Buffer和线驱动
英文描述: LINE TRANSCEIVER, PDSO8
封装: GREEN, PLASTIC, SOIC-8
文件页数: 16/20页
文件大小: 636K
代理商: SN75HVD1176DG4
THERMAL CHARACTERISTICS
(1)
PARAMETER MEASUREMENT INFORMATION
II
IO
VOD
50pF
27
VOC
0Vor3V
A
B
D
www.ti.com ......................................................................................................................................................... SLLS563E – JULY 2003 – REVISED AUGUST 2008
Table 1. SUPPLY CURRENT
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Driver and receiver, RE at 0 V, DE at VCC, All other inputs open, no load
4
6
mA
Driver only, RE at VCC, DE at VCC, All other inputs open, no load
3.8
6
mA
Supply
ICC
Current(1)
Receiver only, RE at 0 V, DE at 0 V, All other inputs open, no load
3.6
6
mA
Standby only, RE at VCC, DE at 0 V, All other inputs open
0.2
5
A
(1)
Over recommended operating conditions
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
Low-K board(4), no air flow
208.3
°C/W
θ
JA
Junction-to-ambient thermal resistance(3)
High-K board(5), no air flow
128.7
°C/W
θ
JB
Junction-to-board thermal resistance
High-K board
77.6
°C/W
θ
JC
Junction-to-case thermal resistance
43.9
°C/W
RL = 54 , CL = 50 pF, 0 V to 3 V,
PD
Device power dissipation
15 MHz, 50% duty cycle square wave
277
318
mW
input, driver and receiver enabled
SN65HVD1176
–40
64
°C
Low-K board, no air flow,
PD = 318 mW
SN75HVD1176
0
°C
TA
Ambient air temperature
SN65HVD1176
–40
89
°C
High-K board, no air flow,
PD = 318 mW
SN75HVD1176
0
°C
TSD
Thermal shut down junction temperature
150
°C
(1)
See Application Information section for an explanation of these parameters.
(2)
All typical values are with VCC = 5 V and TA = 25°C.
(3)
The intent of
θ
JA specification is solely for a thermal performance comparison of one package to another in a standardized environment.
This methodology is not meant to and will not predict the performance of a package in an application-specific environment.
(4)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
(5)
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
NOTE:
Test load capacitance includes probe and jig capacitance (unless otherwise
specified).
Signal generator characteristics: rise and fall time < 6 ns, pulse rate 100 kHz, 50%
duty cycle, Zo = 50 (unless otherwise specified).
Figure 1. Driver Test Circuit, VOD and VOC Without Common-Mode Loading
Copyright 2003–2008, Texas Instruments Incorporated
5
Product Folder Link(s): SN65HVD1176 SN75HVD1176
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