参数资料
型号: SOIC8EV
厂商: Microchip Technology
文件页数: 39/42页
文件大小: 0K
描述: BOARD DEMO 8SOIC/MSOP/TSSOP/DIP
应用说明: Interface Product Design Guide
标准包装: 1
主要目的: 裸评估板
嵌入式:
主要属性: 8 引脚 SOIC/DIP/TSSOP/MSOP 评估板
次要属性: 用于 PICmicro? MCU、ADC、DAC 和其它设备
已供物品: 3 裸板,CD
产品目录页面: 658 (CN2011-ZH PDF)
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER ’S GUIDE
Appendix D. Rev. 1 PCB Errata
D.1
D.2
INTRODUCTION
This appendix documents the issues with the Rev 1 PCB. The Rev 2 PCB fixes these
issues.
REV 1 PCB ISSUES
There are two issues with the Rev 1 PCB. These are:
1. VDD and VSS vias near each pad are No Connects (they should have been
connected to the appropriate power or ground plane). See Figure D-1 shows the
location of these vias that are No Connects. Figure D-3 shows alternate
connections that can be made.
2. The silk-screen on the bottom layer was not processed. This was anly intended
for indicating the circuit of the board. This can be done with a sticky label.
Figure D-2 shows how to determine the PCB revision.
Although these vias were intended to be connected to either the V DD or V SS plane (as indicated), they
are actually no connects. Rev 2 of the board addresses this.
FIGURE D-1:
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber - Top Layer + Silk-Screen.
? 2005 Microchip Technology Inc.
DS51544A-page 35
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