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参数资料
| 型号： | SP3011-06UTG |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | UNIDIRECTIONAL, SILICON, TVS DIODE |
| 封装： | 3.50 X 1.35 MM, 0.50 MM HEIGHT, GREEN, PLASTIC, MO-223, UDFN-14 |
| 文件页数： | 3/4页 |
| 文件大小： | 1159K |
| 代理商： | SP3011-06UTG |
111
2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPAFamily of Products)
Revision: August 8, 2011
SP3011 Series
SP30
11
Low Capacitance ESD Protection - SP3011 Series
Time
Te
mperatur
e
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
Ramp-up
Ramp-down
Ramp-do
Critical Zone
TL to TP
Critical Zone
TL to TP
Reflow Condition
Pb–Freeassembly
Pre Heat
-Temperature Min (T
s(min))
150°C
-Temperature Max (T
s(max))
200°C
-Time (min to max) (t
s)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L) to peak
3°C/second max
T
S(max) to TL - Ramp-up Rate
3°C/second max
Reflow
-Temperature (T
L) (Liquidus)
217°C
-Temperature (t
L)
60 – 150 seconds
PeakTemperature (T
P)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (t
p)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peakTemperature (T
P)
8minutesMax.
Do not exceed
260°C
Soldering Parameters
Product Characteristics
Lead Plating
Pre-PlatedFrame
Lead Material
CopperAlloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
MoldedEpoxy
Flammability
UL94-V-0
Notes:
1.Alldimensionsareinmillimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4.AllspecificationscomplytoJEDECSPECMO-223IssueA
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Part Numbering System
Part Marking System
SP 3011 06 U T G
Series
Package
uDFN-14 (3.5x1.35mm)
T= Tape & Reel
G= Green
Number of
Channels
-06 = 6 Channels
–
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
R H 6
Product Series
R = SP3011
Assembly Site
Number of
Channels
Part Number
Package
Marking
Min. Order Qty.
SP3011-06UTG
uDFN-14
RH6
3000
Ordering Information
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SP3012 | 制造商:LITTELFUSE 制造商全称:Littelfuse 功能描述:SP3012 Series 0.5pF Rail Clamp Array |
| SP3012-04HTG | 制造商:Littelfuse 功能描述:TVS Diode Arrays 4Ch 12KV 0.5pF ESD Protection |
| SP3012-04UTG | 功能描述:TVS二极管阵列 4 Ch 12KV 0.5pF RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP3012-06UTG | 功能描述:TVS二极管阵列 6 Ch 12KV 0.5pF RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP30150R | 制造商:SECOS 制造商全称:SeCoS Halbleitertechnologie GmbH 功能描述:30.0AMP Schottky Barrier Rectifiers |
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