参数资料
型号: SP6203ER-L/TR
厂商: Exar Corporation
文件页数: 11/14页
文件大小: 0K
描述: IC REG LDO ADJ .3A 8DFN
标准包装: 3,000
稳压器拓扑结构: 正,可调式
输出电压: 可调至 1.25V
输入电压: 2.7 V ~ 5.5 V
电压 - 压降(标准): 0.18V @ 300mA
稳压器数量: 1
电流 - 输出: 300mA
电流 - 限制(最小): 330mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘
供应商设备封装: 8-DFN(3x2)
包装: 带卷 (TR)
S P 6 2 0 3 / S P 6 2 0 5
3 0 0 m A / 5 0 0 m A L o w N o i s e C M O S L D O R e g u l a t o r s
After calculation, we find that in such an
application (SP6205) the regulator is limited to
260.6mA. Doing the same calculations for the
300mA LDO (SP6203) will limit the regulator’s
output current to 260.9mA.
Also, taking advantage of the very low dropout
voltage characteristics of the SP6203/6205,
power dissipation can be reduced by using the
lowest possible input voltage to minimize the
input-to-output drop.
A DJUSTABLE R EGULATOR A PPLICATIONS
The SP6203/6205 can be adjusted to a specific
output voltage by using two external resistors
(see functional diagram). The resistors set the
output voltage based on the following
equation:
V OUT = V REF *(R1/R2 + 1)
Resistor values are not critical because ADJ
(adjust) has a high input impedance, but for
best performance use resistors of 470K ? or
less. A bypass capacitor from ADJ to V OUT
provides improved noise performance.
D UAL -S UPPLY O PERATION
When used in dual supply systems where the
regulator load is returned to a negative
supply, the output voltage must be diode
clamped to ground.
L AYOUT C ONSIDERATIONS
The primary path of heat conduction out of the
package is via the package leads. Therefore,
careful considerations have to be taken into
account:
1) Attaching the part to a larger copper
footprint will enable better heat transfer from
the device, especially on PCB’s where there
are internal ground and power planes.
2) Place the input, output and bypass
capacitors close to the device for optimal
transient response and device behavior.
3) Connect all ground connections directly to
the ground plane. In case there’s no ground
plane, connect to a common local ground point
before connecting to board ground.
Such layouts will provide a much better
thermal conductivity (lower θ JA ) for, a higher
maximum allowable power dissipation limit.
? 2012 Exar Corporation
11/14
Rev. 2.0.0
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