参数资料
| 型号： | SP723AB |
| 厂商： | Littelfuse Inc |
| 文件页数： | 2/6页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY ESD 6 INPUT 8-SOIC |
| 标准包装： | 980 |
| 系列： | SP723 |
| 电压 - 工作： | 30V |
| 技术： | 混合技术 |
| 电路数： | 6 |
| 应用： | 通用 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
| 其它名称： | F2167 |
TVS Diode Arrays
Electronic Protection Array for ESD and Overvoltage Protection
SP723
θ JA ( o C/W)
Absolute Maximum Ratings
Continuous Supply Voltage, (V+) - (V-). . . . . . . . . . . . . . . . . . . . . . . . . +35V
Forward Peak Current, IIN to VCC, IIN to GND
(Refer to Figure 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±4A, 100μs
Peak Pulse Current, 8/20μs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7A
ESD Ratings and Capability (Figure 1, Table 1)
Load Dump and Reverse Battery (Note 2)
Thermal Information
Thermal Resistance (Typical, Note 1)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .160
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 o C to 150 o C
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 o C
Lead Temperature (Soldering 10s). . . . . . . . . . . . . .. . . . . . . . . . . . . . 300 o C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specification TA =40 o C to 105 o C, VIN = 0.5VCC, Unless Otherwise Specified
5
ESD Capability
TABLE 1. ESD TEST CONDITIONS
ESD capability is dependent on the application and defined test
standard.The evaluation results for various test standards and methods
STANDARD
TYPE/MODE
R D
C D
± V D
based on Figure 1 are shown in Table 1.
The SP723 has a Level 4 HBM capability when tested as a device to the
IEC 1000-4-2
(Level 4)
HBM, Air Discharge
HBM, Direct Discharge
330 ? 150pF 15kV
330 ? 150pF 8kV
IEC 61000-4-2 standard. Level 4 specifies a required capability greater
than 8kV for direct discharge and greater than 15kV for air discharge.
MIL-STD-3015.7 Modified HBM
Standard HBM
1.5k ? 100pF 25kV
1.5k ? 100pF 10kV
For the “Modified” MIL-STD-3015.7 condition that is defined as an “in-
circuit” method of ESD testing, the V+ and V- pins have a return path to
EIAJ IC121
Machine Model
0k ?
200pF
2kV
ground and the SP723 ESD capability is typically greater than 25kV from
100pF through 1.5k ? . By strict definition of MIL-STD-3015.7 using “pin-
to-pin” device testing, the ESD voltage capability is greater than 10kV.
CHARGE
R 1
R D
DISCHARGE
For the SP723 EIAJ IC121 Machine Model (MM) standard, the ESD capa-
bility is typically greater than 2kV from 200pF with no series resistance.
H.V.
SWITCH
C D
SWITCH
IN
SUPPLY
°± V D
DUT
IEC 1000-4-2: R 1 50 to 100M ?
MIL-STD-3015.7: R 1 1 to 10M ?
FIGURE 1. ELECTROSTATIC DISCHARGE TEST
w w w. l i t t e l f u s e . c o m
241
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SP723ABG | 功能描述:TVS二极管阵列 6 CH DIODE ARRAY RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP723ABG | 制造商:Littelfuse 功能描述:TVS Diode Array |
| SP723ABG | 制造商:Littelfuse 功能描述:THYRISTOR ARRAY TVS |
| SP723ABT | 功能描述:TVS二极管阵列 SP723ABT RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
| SP723ABTG | 功能描述:TVS二极管阵列 6 CH DIODE ARRAY RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C |
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