参数资料
型号: SP723AB
厂商: Littelfuse Inc
文件页数: 5/6页
文件大小: 0K
描述: TVS ARRAY ESD 6 INPUT 8-SOIC
标准包装: 980
系列: SP723
电压 - 工作: 30V
技术: 混合技术
电路数: 6
应用: 通用
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
其它名称: F2167
TVS Diode Arrays
Electronic Protection Array for ESD and Overvoltage Protection
SP723
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N
E1
INCHES
MILLIMETERS
INDEX
AREA
1 2 3
N/2
SYMBOL
MIN
MAX
MIN
MAX
NOTES
-A-
-B-
A
A1
-
0.015
0.210
-
-
0.39
5.33
-
4
4
D
E
BASE
A2
0.115
0.195
2.93
4.95
-
PLANE
SEATING
PLANE
-C-
A2
L
A
CL
B
B1
0.014
0.045
0.022
0.070
0.356
1.15
0.558
1.77
-
8, 10
D1
B1
B
D1
e
0.010 (0.25) M
A 1
e C
C A B S
e A
C
e B
C
D
D1
0.008
0.355
0.005
0.014
0.400
-
0.204
9.01
0.13
0.355
10.16
-
-
5
5
E
0.300
0.325
7.62
8.25
6
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
E1
0.240
0.280
6.10
7.11
5
English and Metric dimensions, the inch dimensions control.
e
0.100 BSC
2.54 BSC
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
e A
e B
0.300 BSC
- 0.430
-
7.62 BSC
10.92
6
7
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
L
N
0.115
8
0.150
2.93
8
3.81
4
9
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and e A are measured with the leads constrained to be per-
pendicular to datum -C- .
7. e B and e C are measured at the lead tips with the leads uncon-
strained. e C must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
244
w w w. l i t t e l f u s e . c o m
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