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参数资料
| 型号： | SP7651ER-L/TR |
| 厂商： | Exar Corporation |
| 文件页数： | 11/15页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 3A 26DFN |
| 标准包装： | 3,000 |
| 系列： | Power Blox™ |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.8 V ~ 19 V |
| 输入电压： | 2.5 V ~ 20 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 900kHz |
| 电流 - 输出： | 3A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 26-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 26-DFN（7x4） |
| 其它名称： | SP7651ER-L/TR-ND |
APPLICATIONS INFORMATION
SP765X Thermal Resistance
The SP765X family has been tested with a
variety of footprint layouts along with differ-
ent copper area and thermal resistance has
been measured. The layouts were done on
4 layer FR4 PCB with the top and bottom
layers using 3oz copper and the power and
ground layers using oz copper.
For the Minimum footprint, only about 0.
square inch of 3 ounces of copper was
used on the top or footprint layer, and this
layer had no vias to connect to the 3 other
layers. For the Medium footprint, about 0.7
square inches of 3 ounces of copper was
used on the top layer, but vias were used
to connect to the other 3 layers. For the
Maximum footprint, about .0 square inch
of 3 ounces of copper was used on the top
layer and many vias were used to connect
to the 3 other layers.
The results show that only about 0.7 square
inches of 3 ounces of copper on the top
layer and vias connecting to the 3 other
layers are needed to get the best thermal
resistance of 36°C/W. Adding area on the
top beyond the 0.7 square inches did not
reduce thermal resistance.
Using a minimum of 0. square inches of
(3 ounces of) Copper on the top layer with
no vias connecting to the 3 other layers
produced a thermal resistance of 44°C/W.
This thermal impedance is only 22% higher
than the medium and large footprint layouts,
indicating that space constrained designs
can still benefit thermally from the Powerblox
family of ICs. This indicates that a minimum
footprint of 0. square inch, if used on a
4 layer board, can produce 44°C/W ther -
mal resistance. This approach is still very
worthwhile if used in a space constrained
design.
The following page shows the footprint
layouts from an ORCAD file. The thermal
data was taken for still air, not with
forced air. If forced air is used, some
improvement in thermal resistance
would be seen.
SP765X Thermal Resistance
4 Layer Board:
Top Layer 3ounces Copper
GND Layer 1ounce Copper
Power Layer ounce Copper
Bottom Layer 3ounces Copper
Minimum Footprint: 44°C/W
Top Layer: 0. square inch
No Vias to other 3 Layers
Medium Footprint: 36°C/W
Top Layer: 0.7 square inch
Vias to other 3 Layers
Maximum Footprint: 36°C/W
Top Layer: .0 square inch
Vias to other 3 Layers
Rev J: 3/ 4/07
SP765 Wide Input Voltage Range 3A, 900kHz, Buck Regulator
? Copyright 2007 Sipex Corporation
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SP7652 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range 6A, 600kHz, Buck Regulator |
| SP7652_06 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range 6A, 600kHz, Buck Regulator |
| SP7652EB | 功能描述:电源管理IC开发工具 Eval Board for SP7652 Series RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| SP7652ER | 制造商:Rochester Electronics LLC 功能描述: 制造商:Exar Corporation 功能描述: |
| SP7652ER/TR | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range 6A, 600kHz, Buck Regulator |
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