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参数资料
| 型号： | SP7653ER-L/TR |
| 厂商： | Exar Corporation |
| 文件页数： | 11/15页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 3A 26DFN |
| 标准包装： | 3,000 |
| 系列： | Power Blox™ |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.8 V ~ 19 V |
| 输入电压： | 2.5 V ~ 20 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 1.3MHz |
| 电流 - 输出： | 3A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 26-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 26-DFN（7x4） |
APPLICATIONS INFORMATION
SP765X Thermal Resistance
The SP765X family has been tested with a
variety of footprint layouts along with different
copper area and thermal resistance has been
measured. The layouts were done on 4 layer
FR4 PCB with the top and bottom layers using
3oz copper and the Power and Ground layers
using 1oz copper.
For the Minimum footprint, only about 0.1 square
inch (of 3 ounces of) copper was used on the top
or footprint layer, and this layer had no vias to
connect to the 3 other layers. For the Medium
footprint, about 0.7 square inches (of 3 ounces
of) copper was used on the top layer, but vias
were used to connect to the other 3 layers. For
the Maximum footprint, about 1.0 square inch
(of 3 ounces of) copper was used on the top layer
and many vias were used to connect to the 3
other layers.
The results show that only about 0.7 square
inches (of 3 ounces of) copper on the top layer
and vias connecting to the 3 other layers are
needed to get the best thermal resistance of
36 ° C/W. Adding area on the top beyond the 0.7
square inches did not reduce thermal resistance.
Using a minimum of 0.1 square inches of (3
ounces of) copper on the top layer with no vias
connecting to the 3 other layers produced a
thermal resistance of 44 ° C/W. This thermal
impedance is only 22% higher than the medium
and large footprint layouts, indicating that space
constrained designs can still benefit thermally
from the Powerblox family of ICs. This indi-
cates that a minimum footprint of 0.1 square
inch, if used on a 4 layer board, can produce
44 ° C/W thermal resistance. This approach is
still very worthwhile if used in a space con-
strained design.
The following page shows the footprint layouts
from an ORCAD file. The thermal data was
taken for still air, not with forced air. If forced
air is used, some improvement in thermal resis-
tance would be seen.
SP765X Thermal Resistance
4 Layer Board:
Top Layer 3ounces Copper
GND Layer 1ounce Copper
Power Layer 1ounce Copper
Bottom Layer 3ounces Copper
Minimum Footprint: 44 ° C/W
Top Layer: 0.1 square inch
No Vias to other 3 Layers
Medium Footprint: 36 ° C/W
Top Layer: 0.7 square inch
Vias to other 3 Layers
Maximum Footprint: 36 ° C/W
Top Layer: 1.0 square inch
Vias to other 3 Layers
Date: 2/17/06
SP7653 Wide Input Voltage Range, 1.3MHz, Buck Regulator
? Copyright 2006 Sipex Corporation
Date: /20/06
SP7653 Wide Input Voltage Range, .3MHz, Buck Regulator
11
? Copyright 2006 Sipex Corporation
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相关代理商/技术参数 |
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|---|---|
| SP7653TR | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range, 1.3MHz,Buck Regulator |
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| SP7655_05 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Evaluation Board Manual |
| SP7655_07 | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range, 8Amp 300kHz, Buck Regulator |
| SP7655EB | 功能描述:电源管理IC开发工具 Eval Board for SP7655 Series RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
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