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参数资料
| 型号： | SP7655EB |
| 厂商： | Exar Corporation |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR SP7655 |
| 标准包装： | 1 |
| 系列： | * |
APPLICATIONS INFORMATION
SP765X Thermal Resistance
The SP765X family has been tested with a
variety of footprint layouts along with different
copper area and thermal resistance has been
measured. The layouts were done on 4 layer
FR4 PCB with the top and bottom layers using
3 ounces of copper and the power and ground
layers using 1 ounce of copper.
For the Minimum footprint, only about 0.1 square
inch (of 3 ounces of) copper was used on the top
or footprint layer, and this layer had no vias to
connect to the 3 other layers. For the Medium
footprint, about 0.7 square inches (of 3 ounces
of) copper was used on the top layer, but vias
were used to connect to the other 3 layers. For
the Maximum footprint, about 1.0 square inch
(of 3 ounces of) copper was used on the top layer
and many vias were used to connect to the 3
other layers.
The results show that only about 0.7 square
inches (of 3 ounces of) copper on the top layer
and vias connecting to the 3 other layers are
needed to get the best thermal resistance of
36 ° C/W. Adding area on the top beyond the 0.7
square inches did not reduce thermal resistance.
Using a minimum of 0.1 square inches of (3
ounces of) copper on the top layer with no vias
connecting to the 3 other layers produced a
thermal resistance of 44 ° C/W. This thermal
impedance is only 22% higher than the medium
and large footprint layouts, indicating that space
constrained designs can still benefit thermally
from the Powerblox family of ICs. This indi-
cates that a minimum footprint of 0.1 square
inch, if used on a 4 layer board, can produce
44 ° C/W thermal resistance. This approach is
still very worthwhile if used in a space con-
strained design.
The following page shows the footprint layouts
from an ORCAD file. The thermal data was
taken for still air, not with forced air. If forced
air is used, some improvement in thermal resis-
tance would be seen.
SP765X Thermal Resistance
4 Layer Board:
Top Layer 3ounces Copper
GND Layer 1ounce Copper
Power Layer 1ounce Copper
Bottom Layer 3ounces Copper
Minimum Footprint: 44 ° C/W
Top Layer: 0.1 square inch
No Vias to other 3 Layers
Medium Footprint: 36 ° C/W
Top Layer: 0.7 square inch
Vias to other 3 Layers
Maximum Footprint: 36 ° C/W
Top Layer: 1.0 square inch
Vias to other 3 Layers
Rev E: 3/2 /07
SP7655 Wide Input Voltage Range 8A, 300kHz, Buck Regulator
0
? 2007 Sipex Corporation
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SP7655ER | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Evaluation Board Manual |
| SP7655ER/TR | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range, 8Amp 300kHz, Buck Regulator |
| SP7655ERL | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range, 8Amp 300kHz, Buck Regulator |
| SP7655ER-L | 功能描述:线性稳压器 - 标准 Buck Regulator RoHS:否 制造商:STMicroelectronics 输出类型: 极性: 输出电压:1.8 V 输出电流:150 mA 负载调节: 最大输入电压:5.5 V 线路调整率: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOT-323-5L |
| SP7655ERL/TR | 制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:Wide Input Voltage Range, 8Amp 300kHz, Buck Regulator |
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