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参数资料
| 型号： | SST38VF6404-90-5I-B3KE |
| 厂商： | Microchip Technology |
| 文件页数： | 9/64页 |
| 文件大小： | 0K |
| 描述： | IC FLASH MPF 64MBIT 90NS 48TFBGA |
| 特色产品： | SST Serial and Parallel Flash Memory |
| 标准包装： | 480 |
| 系列： | SST38 |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（4M x 16） |
| 速度： | 90ns |
| 接口： | 并联 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 48-TFBGA |
| 供应商设备封装： | 48-TFBGA |
| 包装： | 托盘 |
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64 Mbit (x16) Advanced Multi-Purpose Flash Plus
A Microchip Technology Company
SST38VF6401 / SST38VF6402 / SST38VF6403 / SST38VF6404
Data Sheet
Device Operation
The memory operations functions of these devices are initiated using commands written to the device
using standard microprocessor Write sequences. A command is written by asserting WE# low while
keeping CE# low. The address bus is latched on the falling edge of WE# or CE#, whichever occurs
last. The data bus is latched on the rising edge of WE# or CE#, whichever occurs first.
The SST38VF6401/6402/6403/6404 also have the Auto Low Power mode which puts the device in a
near-standby mode after data has been accessed with a valid Read operation. This reduces the I DD
active read current from typically 4 mA to typically 3 μA. The Auto Low Power mode reduces the typical
I DD active read current to the range of 2 mA/MHz of Read cycle time. The device requires no access
time to exit the Auto Low Power mode after any address transition or control signal transition used to
initiate another Read cycle. The device does not enter Auto-Low Power mode after power-up with CE#
held steadily low, until the first address transition or CE# is driven high.
Read
The Read operation of the SST38VF6401/6402/6403/6404 is controlled by CE# and OE#, both of which
have to be low for the system to obtain data from the outputs. CE# is used for device selection. When
CE# is high, the chip is deselected and only standby power is consumed. OE# is the output control and
is used to gate data from the output pins. The data bus is in high impedance state when either CE# or
OE# is high. Refer to Figure 5, the Read cycle timing diagram, for further details.
Page Read
The Page Read operation utilizes an asynchronous method that enables the system to read data from
the SST38VF6401/6402/6403/6404 at a faster rate. This operation allows users to read a four-word
page of data at an average speed of 41.25 ns per word.
In Page Read, the initial word read from the page requires T ACC to be valid, while the remaining three
words in the page require only T PACC . All four words in the page have the same address bits, A 21 -A 2 ,
which are used to select the page. Address bits A 1 and A 0 are toggled, in any order, to read the words
within the page.
The Page Read operation of the SST38VF6401/6402/6403/6404 is controlled by CE# and OE#. Both
CE# and OE# must be low for the system to obtain data from the output pins. CE# controls device
selection. When CE# is high, the chip is deselected and only standby power is consumed. OE# is the
output control and is used to gate data from the output pins. The data bus is in high impedance state
when either CE# or OE# is high. Refer to Figure 6, the Page Read cycle timing diagram, for further
details.
Word-Program Operation
The SST38VF6401/6402/6403/6404 can be programmed on a word-by-word basis. Before program-
ming, the sector where the word exists must be fully erased. The Program operation is accomplished
in three steps. The first step is the three-byte load sequence for Software Data Protection. The second
step is to load word address and word data. During the Word-Program operation, the addresses are
latched on the falling edge of either CE# or WE#, whichever occurs last. The data is latched on the ris-
ing edge of either CE# or WE#, whichever occurs first. The third step is the internal Program operation
which is initiated after the rising edge of the fourth WE# or CE#, whichever occurs first. The Program
operation, once initiated, will be completed within 10 μs. See Figures 7 and 8 for WE# and CE# con-
trolled Program operation timing diagrams and Figure 24 for flowcharts.
?2011 Silicon Storage Technology, Inc.
9
DS-25015A
04/11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SST38VF6404-90-5I-EKE | 功能描述:闪存 2.7 to 3.6V 64Mbit Parallel Adv MPF+ RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| SST38VF6404B | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:64 Mbit (x16) Advanced Multi-Purpose Flash Plus |
| SST38VF6404B-70-5I-B3KE | 功能描述:闪存 2.7- 3.6V 64Mbit pm Parallel Advance MPF RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| SST38VF6404B-70-5I-B3KE-T | 功能描述:闪存 2.7- 3.6V 64Mbit pm Parallel Advance MPF RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| SST38VF6404B-70-5I-CD | 制造商:Microchip Technology Inc 功能描述:2.7 TO 3.6V 64MBIT PM PARALLEL ADVANCED MPF - Trays 制造商:Microchip Technology Inc 功能描述:IC FLASH 64MBIT 70NS 48TFBGA 制造商:Microchip Technology Inc 功能描述:2.7 - 3.6V 64Mbit pm Parallel Advance MPF |
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