参数资料
型号: SST39VF1602-70-4I-EKE
厂商: Microchip Technology
文件页数: 13/34页
文件大小: 0K
描述: IC FLASH MPF 16MBIT 70NS 48TSOP
特色产品: SST Serial and Parallel Flash Memory
标准包装: 96
系列: SST39 MPF™
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 16M (1M x 16)
速度: 70ns
接口: 并联
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 48-TFSOP(0.724",18.40mm 宽)
供应商设备封装: 48-TSOP
包装: 托盘
产品目录页面: 1453 (CN2011-ZH PDF)
16 Mbit / 32 Mbit Multi-Purpose Flash Plus
SST39VF1601 / SST39VF3201
A Microchip Technology Company
SST39VF1602 / SST39VF3202
Not Recommended for New Designs
Table 8: System Interface Information for SST39VF160x/320x
Address
1BH
1CH
1DH
1EH
1FH
20H
21H
22H
23H
24H
25H
26H
Data
0027H
0036H
0000H
0000H
0003H
0000H
0004H
0005H
0001H
0000H
0001H
0001H
Data
V DD Min (Program/Erase)
DQ 7 -DQ 4 : Volts, DQ 3 -DQ 0 : 100 millivolts
V DD Max (Program/Erase)
DQ 7 -DQ 4 : Volts, DQ 3 -DQ 0 : 100 millivolts
V PP min. (00H = no V PP pin)
V PP max. (00H = no V PP pin)
Typical time out for Word-Program 2 N μs (2 3 = 8 μs)
Typical time out for min. size buffer program 2 N μs (00H = not supported)
Typical time out for individual Sector/Block-Erase 2 N ms (2 4 = 16 ms)
Typical time out for Chip-Erase 2 N ms (2 5 = 32 ms)
Maximum time out for Word-Program 2 N times typical (2 1 x 2 3 = 16 μs)
Maximum time out for buffer program 2 N times typical
Maximum time out for individual Sector/Block-Erase 2 N times typical (2 1 x 2 4 = 32
ms)
Maximum time out for Chip-Erase 2 N times typical (2 1 x 2 5 = 64 ms)
T8.3 25028
Table 9: Device Geometry Information for SST39VF1601/1602
Address
27H
28H
29H
2AH
2BH
2CH
2DH
2EH
2FH
30H
31H
32H
33H
34H
Data
0015H
0001H
0000H
0000H
0000H
0002H
00FFH
0001H
0010H
0000H
001FH
0000H
0000H
0001H
Data
Device size = 2 N Bytes (15H = 21; 2 21 = 2 MByte)
Flash Device Interface description; 0001H = x16-only asynchronous interface
Maximum number of byte in multi-byte write = 2 N (00H = not supported)
Number of Erase Sector/Block sizes supported by device
Sector Information (y + 1 = Number of sectors; z x 256B = sector size)
y = 511 + 1 = 512 sectors (01FF = 511
z = 16 x 256 Bytes = 4 KByte/sector (0010H = 16)
Block Information (y + 1 = Number of blocks; z x 256B = block size)
y = 31 + 1 = 32 blocks (001F = 31)
z = 256 x 256 Bytes = 64 KByte/block (0100H = 256)
T9.0 25028
?2011 Silicon Storage Technology, Inc.
13
DS25028A
08/11
相关PDF资料
PDF描述
25LC256-I/MF IC EEPROM 256KBIT 10MHZ 8DFN
24FC512-I/ST IC EEPROM 512KBIT 1MHZ 8TSSOP
25LC512-I/MF IC EEPROM 512KBIT 20MHZ 8DFN
SST39VF1601-70-4I-EKE IC FLASH MPF 16MBIT 70NS 48TSOP
SST39WF1601-70-4I-MAQE IC FLASH MPF 16MBIT 70NS 48WFBGA
相关代理商/技术参数
参数描述
SST39VF1602-70-4I-EKE-T 功能描述:闪存 2.7 to 3.6V 16Mbit Multi-Purpose 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF1602C-70-4C-B3KE 功能描述:闪存 16M (1Mx16) 70ns Commercial Temp RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF1602C-70-4C-EKE 功能描述:闪存 16M (1Mx16) 70ns Commercial Temp RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF1602C-70-4C-MAQE 功能描述:闪存 2.7V to 3.6V 16Mbit Multi-Purpose 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39VF1602C-70-4I-B3KE 功能描述:闪存 16M (1Mx16) 70ns Industrial Temp RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel