参数资料
型号: SST39WF1602-70-4I-B3KE
厂商: Microchip Technology
文件页数: 17/34页
文件大小: 0K
描述: IC FLASH MPF 16MBIT 70NS 48TFBGA
标准包装: 480
系列: SST39 MPF™
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 16M (1M x 16)
速度: 70ns
接口: 并联
电源电压: 1.65 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 48-TFBGA
供应商设备封装: 48-TFBGA
包装: 托盘
16 Mbit Multi-Purpose Flash Plus
A Microchip Technology Company
SST39WF1601 / SST39WF1602
Data Sheet
AC Characteristics
Table 16: Read Cycle Timing Parameters V DD = 1.65-1.95V
Symbol
Parameter
Min
Max
Units
T RC
T CE
T AA
T OE
Read Cycle Time
Chip Enable Access Time
Address Access Time
Output Enable Access Time
70
70
70
35
ns
ns
ns
ns
T CLZ
1
CE# Low to Active Output
0
ns
T OLZ1
T CHZ1
T OHZ1
OE# Low to Active Output
CE# High to High-Z Output
OE# High to High-Z Output
0
40
40
ns
ns
ns
T OH
1
Output Hold from Address Change
0
ns
T RP1
T RHR1
T RY1,2
RST# Pulse Width
RST# High before Read
RST# Pin Low to Read Mode
500
50
20 3
ns
ns
μs
T16.0 25014
1. This parameter is measured only for initial qualification and after a design or process change that could affect this
parameter.
2. This parameter applies to Sector-Erase, Block-Erase and Program operations.
This parameter does not apply to Chip-Erase operations.
3. This parameter is 100 μs if reset after an Erase operation.
Table 17: Program/Erase Cycle Timing Parameters
Symbol
Parameter
Min
Max
Units
T BP
T AS
T AH
T CS
T CH
T OES
T OEH
T CP
T WP
T WPH1
T CPH1
T DS
T DH1
T IDA1
T SE
T BE
T SCE
Word-Program Time
Address Setup Time
Address Hold Time
WE# and CE# Setup Time
WE# and CE# Hold Time
OE# High Setup Time
OE# High Hold Time
CE# Pulse Width
WE# Pulse Width
WE# Pulse Width High
CE# Pulse Width High
Data Setup Time
Data Hold Time
Software ID Access and Exit Time
Sector-Erase
Block-Erase
Chip-Erase
0
50
0
0
0
10
50
50
30
30
50
0
40
150
50
50
200
μs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ms
ms
T17.0 25014
1. This parameter is measured only for initial qualification and after a design or process change that could affect this
parameter.
?2011 Silicon Storage Technology, Inc.
17
DS-25014A
04/11
相关PDF资料
PDF描述
SST39WF1602-70-4C-B3KE IC FLASH MPF 16MBIT 70NS 48TFBGA
1-745130-0 CONN FERRULE CRIMP DB9,15,50
1-745129-8 CONN FERRULE CRIMP DB9,15,50
SST39VF1601C-70-4I-B3KE IC FLASH MPF 16MBIT 70NS 48TFBGA
SST39VF1602C-70-4C-B3KE IC FLASH MPF 16MBIT 70NS 48TFBGA
相关代理商/技术参数
参数描述
SST39WF1602-70-4I-B3KE-T 功能描述:闪存 1.65V to 1.95V 16Mbit Multi-Prps Fl RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39WF1602-70-4I-MAQE 功能描述:闪存 1.65V to 1.95V 16mb Multi-Purpose 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39WF1602-70-4I-MAQE-T 功能描述:闪存 1.65V to 1.95V 16Mbit Multi-Prps Fl RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39WF1602-70-4I-MBQE 功能描述:闪存 16M (1Mx16) 70ns Industrial Temp RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST39WF1602-90-4C-B3KE 功能描述:闪存 1.65V to 1.95V 16mb Multi-Purpose 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel