参数资料
型号: ST72311N2T3/XXX
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 8-BIT, MROM, 8 MHz, MICROCONTROLLER, PQFP64
封装: PLASTIC, TQFP-64
文件页数: 77/92页
文件大小: 624K
代理商: ST72311N2T3/XXX
79/92
ST72311
6 ELECTRICAL CHARACTERISTICS
6.1 ABSOLUTE MAXIMUM RATINGS
This product contains devices to protect the inputs
against damage due to high static voltages, how-
ever it is advisable to take normal precaution to
avoid application of any voltage higher than the
specified maximum rated voltages.
For proper operation it is recommended that VI
and VO be higher than VSS and lower than VDD.
Reliability is enhanced if unused inputs are con-
nected to an appropriate logic voltage level (VDD
or VSS).
Power Considerations.The average chip-junc-
tion temperature, TJ, in Celsius can be obtained
from:
TJ=
TA + PD x RthJA
Where: TA =
Ambient Temperature.
RthJA = Package thermal resistance
(junction-to ambient).
PD =PINT +PPORT.
PINT =IDD xVDD (chip internal power).
PPORT =Port power dissipation
determined by the user)
Note: Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at these conditions is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
Symbol
Parameter
Value
Unit
VDD
Digital Supply Voltage
-0.3 to 6.0
V
VDDA
Analog Supply and Reference Voltage
VDD - 0.3 to VDD + 0.3
V
VI
Input Voltage
VSS - 0.3 to VDD + 0.3
V
VAI
Analog Input Voltage (A/D Converter)
VSS - 0.3 to VDD + 0.3
VSSA-0.3 to VDDA+0.3
V
VO
Output Voltage
VSS - 0.3 to VDD + 0.3
V
IVDD
Total Current into VDD (source)
100
mA
IVSS
Total Current out of VSS (sink)
100
mA
TJ
Junction Temperature
150
°C
TSTG
Storage Temperature
-60 to 150
°C
79
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