参数资料
型号: ST72C254G1B7
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 8-BIT, FLASH, 6 MHz, MICROCONTROLLER, PDIP32
封装: SHRINK, PLASTIC, DIP-32
文件页数: 34/136页
文件大小: 929K
代理商: ST72C254G1B7
ST72104G, ST72215G, ST72216G, ST72254G
129/136
15.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 99 and Figure 100.
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
s
Heraeus: PD945, PD955
s
Loctite: 3615, 3298
Figure 99. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 100. Recommended Reflow Soldering Oven Profile (MID JEDEC)
15.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL
Table 24. Suggested List of SDIP32 Socket Types
Table 25. Suggested List of SO28 Socket Types
Package / Probe
Adaptor / Socket Reference
Same
Footp rint
Socket Type
SDIP32
EMU PROBE
TEXTOOL
232-1291-00
X
Textool
Package / Probe
Adaptor / Socket Reference
Same
Footp rint
Socket Type
SO28
ENPLAS
OTS-28-1.27-04
Open Top
YAMAICHI
IC51-0282-334-1
Clamshell
EMU PROBE
Adapter from SO28 to SDIP32 footprint (delivered with emulator)
X
SMD to SDIP
250
200
150
100
50
0
40
80
120
160
Time [sec]
Temp. [
°C]
20
60
100
140
5 sec
COOLING PHASE
(ROOM TEMPERATURE)
PREHEATING
80
°C
PHASE
SOLDERING
PHASE
250
200
150
100
50
0
100
200
300
400
Time [sec]
Temp. [
°C]
ramp up
2
°C/sec for 50sec
90 sec at 125
°C
150 sec above 183
°C
ramp down natural
2
°C/sec max
Tmax=220+/-5
°C
for 25 sec
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ST72C254G2B1 制造商:STMicroelectronics 功能描述:8-BIT MICROCONTROLLER - Bulk
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ST72C254G2B6 制造商:STMicroelectronics 功能描述:8BIT MCU FLASH 8K 72C254 DIP32
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