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ST72561-Auto
Revision history
Doc ID 12370 Rev 7
23-Jun-2006
5
Replaced TQFP with LQFP packages throughout document
Changed device summary on Table 2: Product overview
Changed Section 8.2.1: Input modes
Changed title of Section 8.4: I/O port register configurations from “I/O Port
Implementation” to “I/O Port Register Configurations”
Changed Master mode operation
Corrected name of bit 5 in SPICSR register in Table 59: SPI register map and reset
values
Changed Section 20.5.2: PLL characteristics
Added links to Table 111: Absolute maximum ratings and Table 112: Electrical
sensitivities in Section 20.8.3: Absolute maximum ratings (electrical sensitivity)
Removed EMC protection circuitry in Figure 136: RESET pin protection when LVD is
disabled (device works correctly without these components)
Changed Section 20.12.1: SPI - serial peripheral interface
Changed title of Figure 147: 64-pin low profile quad flat package (14x14)
Changed title of Figure 148: 32-pin low profile quad flat package (7x7)
Changed title of Figure 149: 44-pin low profile quad flat package (10x10)
Changed notes in Table 21.3: Thermal characteristics
Changed AFI mapping for Option byte 1
Changed Figure 154: ST72561xxx-Auto ROM commercial product structure,
Figure 153: ST72P561xxx-Auto FastROM commercial product structure and
Figure 152: ST72F561xxx-Auto Flash commercial product structure
Changed Section 20.12.1: SPI - serial peripheral interface
Deleted Section 15.1.5 “Clearing active interrupts outside interrupt routine” (text
already exists in Section 24.1.2: Clearing active interrupts outside interrupt routine)
Added Section 24.1.5: Header time-out does not prevent wake-up from mute mode
11-Mar-2008
6
Removed ‘F’ from root part numbers and removed references to ‘automotive only’
devices in the Table 2: Product overview
Removed ‘mcu’ from the URL reference in ST72561-Auto MICROCONTROLLER
OPTION LIST and Chapter 23: Development tools
Removed section on “SOLDERING AND GLUEABILITY INFORMATION” and
replaced with Section 21.4: Packaging for automatic handling
Removed references to standard device temperature codes from Figure 154:
ST72561xxx-Auto ROM commercial product structure, Figure 153: ST72P561xxx-
Auto FastROM commercial product structure and Figure 152: ST72F561xxx-Auto
Flash commercial product structure
Made small editing changes throughout document to improve readability
02-Aug-2010
7
Updated following figures:
– Figure 152: ST72F561xxx-Auto Flash commercial product structure
– Figure 153: ST72P561xxx-Auto FastROM commercial product structure
– Figure 154: ST72561xxx-Auto ROM commercial product structure
Added Chapter 21.4: Packaging for automatic handling
Table 120.
Document revision history (continued)
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