参数资料
型号: STM32F103ZDT6XXX
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP144
封装: 20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-144
文件页数: 11/122页
文件大小: 1599K
代理商: STM32F103ZDT6XXX
Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
108/122
Doc ID 14611 Rev 6
Figure 60.
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package outline
1.
Drawing is not to scale.
2.
Primary datum Z and seating plane are defined by the spherical crowns of the ball.
Table 66.
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Symbol
millimeters
inches(1)
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
Min
Typ
Max
Min
Typ
Max
A
0.535
0.585
0.635
0.0211
0.0230
0.0250
A1
0.205
0.230
0.255
0.0081
0.0091
0.0100
A2
0.330
0.355
0.380
0.0130
0.0140
0.0150
b(2)
2.
Dimension is measured at the maximum ball diameter parallel to primary datum Z.
0.290
0.320
0.350
0.0114
0.0126
0.0138
e
0.500
0.0197
e1
3.500
0.1378
F
0.447
0.0176
G
0.483
0.0190
D
4.446
4.466
4.486
0.1750
0.1758
0.1766
E
4.375
4.395
4.415
0.1722
0.1730
0.1738
H
0.250
0.0098
L
0.200
0.0079
eee
0.05
0.0020
aaa
0.10
0.0039
Number of balls
64
A
B
C
D
E
F
G
H
1
2
3
4
5
6
7
8
Detail A
Side view
Ball side
Wafer back side
Marking area
A1 ball corner
A
A2
A1 ball corner
Notch
Ball
A1
b
Seating plane (see note 2)
Detail A rotated 90
CR_ME
e
e1
F
G
D
E
aaa
eee
H
L
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