参数资料
型号: STPCI2EEYC
厂商: STMICROELECTRONICS
元件分类: 外设及接口
英文描述: MULTIFUNCTION PERIPHERAL, PBGA516
封装: PLASTIC, BGA-516
文件页数: 52/80页
文件大小: 854K
代理商: STPCI2EEYC
BOARD LAYOUT
Issue 0.4 - July 16, 2001
56/80
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
The PBGA Package also dissipates heat through
peripheral ground balls. When a heat sink is
placed on the device, heat is more uniformly
spread throughout the moulding, increasing heat
dissipation through the peripheral ground balls.
The more via pads that are connected to each
ground ball, the more heat is dissipated. The only
limitation is the risk of losing routing channels.
Figure 5-5 shows a routing with a good trade off
between thermal dissipation and the number of
routing channels.
Figure 5-4. OptimumLlayout for Central Ground Ball
Via to Ground layer
Pad for ground ball
Clearance = 6mil
diameter = 25 mil
hole diameter = 14 mil
Solder mask
diameter = 33 mil
External diameter = 37 mil
connections = 10 mil
Figure 5-5. Global Ground Layout for Good Thermal Dissipation
Top Vie w
1
A
V iato g ro un dla y e r
G round pad
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