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参数资料
| 型号： | STR715FRT3 |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PQFP64 |
| 封装： | 10 X 10 MM, LQFP-64 |
| 文件页数： | 29/78页 |
| 文件大小： | 2018K |
| 代理商： | STR715FRT3 |
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STR71xF
Electrical parameters
35/78
Notes:
1.
IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN>V33 while a negative injection is induced by VIN<VSS. For true open-drain pads,
there is no positive injection current, and the corresponding VIN maximum must always be respected. Data
based on TA = 25 °C.
2.
All 3.3V power (V33, AVDD, V33IO-PLL) and ground (VSS, AVSS, VSSIO-PLL) pins must always be connected
to the external 3.3V supply.
3.
Negative injection disturbs the analog performance of the device. See note in Section 4.3.11: ADC
4.
When several inputs are submitted to a current injection, the maximum
ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with
ΣI
INJ(PIN) maximum current injection on four I/O port pins of the device.
5.
Only when using external 1.8V power supply. All the power (V18, V18BKP) and ground (VSS18, VSSBKP) pins
must always be connected to the external 1.8V supply.
Table 11.
Current characteristics
Symbol
Ratings
Max.
Unit
IV33
Total current into V33/V33IO-PLL power lines (source)
2)
150
mA
IVSS
Total current out of VSS/VSSIO-PLL ground lines (sink)
2)
150
IIO
Output current sunk by any I/O and control pin
25
Output current source by any I/Os and control pin
- 25
IINJ(PIN)
1) 3)
Injected current on RSTIN pin
± 5
Injected current on CK pin
± 5
Injected current on any other pin 4)
± 5
ΣIINJ(PIN) 1)
Total injected current (sum of all I/O and control pins) 4)
± 25
Table 12.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
-65 to +150
°C
TJ
Maximum junction temperature (see Section 5.2: Thermal characteristics on
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