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参数资料
| 型号： | STR715FRT3 |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PQFP64 |
| 封装： | 10 X 10 MM, LQFP-64 |
| 文件页数： | 70/78页 |
| 文件大小： | 2018K |
| 代理商： | STR715FRT3 |
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Package characteristics
STR71xF
72/78
5.2
Thermal characteristics
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)
(1)
Where:
●
TA is the Ambient Temperature in °C,
●
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
●
PD is the sum of PINT and PI/O (PD = PINT + PI/O),
●
PINT is the product of IDD and VDD, expressed in Watts. This is the Chip Internal Power.
PI/O represents the Power Dissipation on Input and Output Pins;
Most of the time for the application PI/O< PINT and can be neglected. On the other hand, PI/O
may be significant if the device is configured to drive continuously external modules and/or
memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C)
(2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD
2
(3)
where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ
may be obtained by solving equations (1) and (2) iteratively for any value of TA.
Table 44.
Thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal Resistance Junction-Ambient
LQFP 144 - 20 x 20 mm / 0.5 mm pitch
42
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
45
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
58
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LFBGA 144 - 10 x 10 x 1.7mm
50
°C/W
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相关代理商/技术参数 |
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