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参数资料
| 型号： | STR912FAW44X6T |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 96 MHz, RISC MICROCONTROLLER, PQFP128 |
| 封装： | 14 X 14 MM, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, LQFP-128 |
| 文件页数： | 97/100页 |
| 文件大小： | 1801K |
| 代理商： | STR912FAW44X6T |
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Package mechanical data
STR91xFAxxx
Figure 43.
Recommended PCB design rules (0.80/0.75 mm pitch BGA)
9.1
ECOPACK
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
9.2
Thermal characteristics
The average chip-junction temperature, TJ must never exceed 125 °C.
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)(1)
Where:
●
TA is the ambient temperature in ° C,
●
ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
●
PD is the sum of PINT and PI/O (PD = PINT + PI/O),
●
PINT is the product of IDD and VDD, expressed in Watts. This is the Chip Internal Power.
PI/O represents the power dissipation on input and output pins;
Most of the time for the applications PI/O< PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories. The worst case PINT of the STR91xFA is 500 mW (IDD x VDD, or 250 mA x
2.0 V).
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273 °C)
(2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273 °C) + ΘJA x PD
2
(3)
Where:
●
K is a constant for the particular part, which may be determined from equation (3) by
measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD
and TJ may be obtained by solving equations (1) and (2) iteratively for any value of TA.
Dpad
Dsm
Dpad
0.37 mm
Dsm
0.52 mm typ. (depends on solder
mask registration tolerance
Solder paste
0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
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相关代理商/技术参数 |
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| STR912FAW46 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:ARM966E-S⑩ 16/32-Bit Flash MCU with Ethernet, USB, CAN, AC motor control, 4 timers, ADC, RTC, DMA |
| STR912FAW46X6 | 功能描述:ARM微控制器 - MCU ARM966E-S 16 Bit MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
| STR912FAW46X6T | 功能描述:ARM微控制器 - MCU ARM966 MCU 16/32-bit Ethernet RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
| STR912FAW47 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:ARM966E-S⑩ 16/32-Bit Flash MCU with Ethernet, USB, CAN, AC motor control, 4 timers, ADC, RTC, DMA |
| STR912FAW47X6 | 功能描述:ARM微控制器 - MCU ARM966E-S 16 Bit MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
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