参数资料
| 型号： | SY88149HLMG TR |
| 厂商： | Micrel Inc |
| 文件页数： | 11/11页 |
| 文件大小： | 0K |
| 描述： | IC POST AMP BURST GEPON/GPON 16M |
| 标准包装： | 1,000 |
| 类型： | 限幅后置放大器 |
| 应用： | 光纤学网络 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，16-MLF? |
| 供应商设备封装： | 16-MLF?（3x3） |
| 包装： | 带卷 (TR) |
IDT / ICS HSTL FREQUENCY SYNTHESIZER
9
ICS8421002AGI-01 REV B
MARCH 02, 2009
ICS8421002I-01
FEMTOCLOCKS CRYSTAL-TO-HSTL FREQUENCY SYNTHESIZER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8421002I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8421002I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* I
DD_MAX
= 3.465V * 122mA = 422.7mW
Power (outputs)
MAX
= 32.8mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 32.8mW = 65.6mW
Total Power
_MAX
(3.465V, with all outputs switching) = 422.7mW + 65.6mW = 488.3mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.488W * 66.6°C/W = 117.5°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
98.0°C/W
88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
73.2°C/W
66.6°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-PIN TSSOP, FORCED CONVECTION
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相关代理商/技术参数 |
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| SY88149NDL | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:1.25Gbps Burst-Mode Limiting Amplifier |
| SY88149NDL_12 | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:1.25Gbps Burst-Mode Limiting Amplifier |
| SY88149NDLMG | 功能描述:限幅放大器 1.25Gbps GPON Burst Mode Limiting Amplifier RoHS:否 制造商:Micrel 输入电压范围（最大值）:3.6 V 工作电源电压:3.3 V 电源电流:40 mA 工作温度范围:- 40 C to + 85 C 封装 / 箱体:MSOP-10 封装:Tube |
| SY88149NDLMG TR | 功能描述:限幅放大器 1.25Gbps GPON Burst Mode Limiting Amplifier RoHS:否 制造商:Micrel 输入电压范围（最大值）:3.6 V 工作电源电压:3.3 V 电源电流:40 mA 工作温度范围:- 40 C to + 85 C 封装 / 箱体:MSOP-10 封装:Tube |
| SY88149NDLMGTR | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:1.25Gbps Burst-Mode Limiting Amplifier |
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