参数资料
型号: T525D337M006ATE025
厂商: Kemet
文件页数: 11/16页
文件大小: 0K
描述: CAP TANT 330UF 6.3V 20% 2917
产品培训模块: Capacitor Basics- Typical Uses for Capacitors
产品目录绘图: T49, T5(1,2,3) Series Markings
T49x, T5xx Series_C, D, E, L, U, V, W, X, Y-side2
T49x, T5xx Series_D-bottom
T49x, T5xx Series_D-side1
标准包装: 1
系列: KO Cap T525
电容: 330µF
电压 - 额定: 6.3V
容差: ±20%
ESR(等效串联电阻): 25 毫欧
类型: 模制
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 2917(7343 公制)
尺寸/尺寸: 0.287" L x 0.169" W(7.30mm x 4.30mm)
高度 - 座高(最大): 0.122"(3.10mm)
制造商尺寸代码: D
特点: 聚合物
包装: 标准包装
产品目录页面: 2038 (CN2011-ZH PDF)
其它名称: 399-3279-6
KEMET Organic Capacitor (KO-CAP) – T525 125°C Rated Polymer Tantalum
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T 2
?Do
P 2
Po
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E 1
Ao
F
B 1
Ko
Bo
E 2
W
S 1
P 1
T 1
?D 1
User Direction of Unreeling
Center Lines of Cavity
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o .
Embossment
For cavity size,
see Note 1 Table 4
Table 4 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
D 0
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
D 1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E 1
1.75 ±0.10
(0.069 ±0.004)
P 0
4.0 ±0.10
(0.157 ±0.004)
P 2
2.0 ±0.05
(0.079 ±0.002)
R Reference
Note 2
25.0
(0.984)
30
(1.181)
S 1 Minimum
Note 3
0.600
(0.024)
T Maximum T 1 Maximum
0.600 0.100
(0.024) (0.004)
Tape Size
8 mm
12 mm
16 mm
Pitch
Single (4 mm)
Single (4 mm) &
Double (8 mm)
Triple (12 mm)
B 1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
Variable Dimensions — Millimeters (Inches)
E 2 Minimum F P 1 T 2 Maximum
6.25 3.5 ±0.05 4.0 ±0.10 2.5
(0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098)
10.25 5.5 ±0.05 8.0 ±0.10 4.6
(0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181)
14.25 5.5 ±0.05 8.0 ±0.10 4.6
(0.561) (0.217 ±0.002) (0.315 ±0.004) (0.181)
W Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A 0 , B 0 & K 0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 5).
3. If S 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B 1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A 0 , B 0 and K 0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
T2017_T525 ? 2/3/2014
11
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