参数资料
型号: T525D337M006ATE025
厂商: Kemet
文件页数: 7/16页
文件大小: 0K
描述: CAP TANT 330UF 6.3V 20% 2917
产品培训模块: Capacitor Basics- Typical Uses for Capacitors
产品目录绘图: T49, T5(1,2,3) Series Markings
T49x, T5xx Series_C, D, E, L, U, V, W, X, Y-side2
T49x, T5xx Series_D-bottom
T49x, T5xx Series_D-side1
标准包装: 1
系列: KO Cap T525
电容: 330µF
电压 - 额定: 6.3V
容差: ±20%
ESR(等效串联电阻): 25 毫欧
类型: 模制
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 2917(7343 公制)
尺寸/尺寸: 0.287" L x 0.169" W(7.30mm x 4.30mm)
高度 - 座高(最大): 0.122"(3.10mm)
制造商尺寸代码: D
特点: 聚合物
包装: 标准包装
产品目录页面: 2038 (CN2011-ZH PDF)
其它名称: 399-3279-6
KEMET Organic Capacitor (KO-CAP) – T525 125°C Rated Polymer Tantalum
Reverse Voltage
Polymer tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected in the wrong polarity.
These devices will withstand a small degree of transient voltage reversal for short periods as shown in the below table.
Temperature
25°C
55°C
85°C
105°C
125°C*
Permissible Transient Reverse Voltage
15% of Rated Voltage
10% of Rated Voltage
5% of Rated Voltage
3% of Rated Voltage
1% of Rated Voltage
*For series rated to 125°C
Table 2 – Land Dimensions/Courtyard
KEMET
Metric
Size
Code
Density Level A:
Maximum (Most) Land
Protrusion (mm)
Density Level B:
Median (Nominal) Land
Protrusion (mm)
Density Level C:
Minimum (Least) Land
Protrusion (mm)
Case
A
B
C
D
L
M
H
E 1
Q
R 2
S 2
T
U
V
W
X 1
Y 1
EIA
3216 –18
3528 –21
6032–25
7343 –31
6032-19
3528-15
7360-20
7360 –38
7343-12
2012-12
3216 –12
3528 –12
6032–15
7343 –20
7343 –15
7343 –43
7343 –40
W
1.35
2.35
2.35
2.55
2.35
2.35
4.25
4.25
2.55
1.05
1.35
2.35
2.35
2.55
2.55
2.55
2.55
L
2.20
2.21
2.77
2.77
2.77
2.20
2.77
2.77
2.77
1.83
2.20
2.20
2.77
2.77
2.77
2.77
2.77
S
0.62
0.92
2.37
3.67
2.37
0.92
3.67
3.67
3.67
0.15
0.62
0.92
2.37
3.67
3.67
3.67
3.67
V1
6.02
6.32
8.92
10.22
8.92
6.32
10.22
10.22
10.22
4.82
6.02
6.32
8.92
10.22
10.22
10.22
10.22
V2
2.80
4.00
4.50
5.60
4.50
4.00
7.30
7.30
5.60
2.50
2.80
4.00
4.50
5.60
5.60
5.60
5.60
W
1.23
2.23
2.23
2.43
2.23
2.23
4.13
4.13
2.43
0.93
1.23
2.23
2.23
2.43
2.43
2.43
2.43
L
1.80
1.80
2.37
2.37
2.37
1.80
2.37
2.37
2.37
1.50
1.80
1.80
2.37
2.37
2.37
2.37
2.37
S
0.82
1.12
2.57
3.87
2.57
1.12
3.87
3.87
3.87
0.22
0.82
1.12
2.57
3.87
3.87
3.87
3.87
V1
4.92
5.22
7.82
9.12
7.82
5.22
9.12
9.12
9.12
3.72
4.92
5.22
7.82
9.12
9.12
9.12
9.12
V2
2.30
3.50
4.00
5.10
4.00
3.50
6.80
6.80
5.10
2.00
2.30
3.50
4.00
5.10
5.10
5.10
5.10
W
1.13
2.13
2.13
2.33
2.13
2.13
4.03
4.03
2.33
0.83
1.13
2.13
2.13
2.33
2.33
2.33
2.33
L
1.42
1.42
1.99
1.99
1.99
1.42
1.99
1.99
1.99
1.12
1.42
1.42
1.99
1.99
1.99
1.99
1.99
S
0.98
1.28
2.73
4.03
2.73
1.28
4.03
4.03
4.03
0.38
0.98
1.28
2.73
4.03
4.03
4.03
4.03
V1
4.06
4.36
6.96
8.26
6.96
4.36
8.26
8.26
8.26
2.86
4.06
4.36
6.96
8.26
8.26
8.26
8.26
V2
2.04
3.24
3.74
4.84
3.74
3.24
6.54
6.54
4.84
1.74
2.04
3.24
3.74
4.84
4.84
4.84
4.84
Land pattern geometry is too small for silkscreen outline.
Density Level A: For low-density product applications. Recommended for wave solder applications and
provides a wider process window for reflow solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder
attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land
pattern variations the user should perform qualification testing based on the conditions outlined in IPC
standard 7351 (IPC –7351).
1 Height of these chips may create problems in wave soldering.
2
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
T2017_T525 ? 2/3/2014
7
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