参数资料
型号: TAS5631PHD
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: AUDIO AMPLIFIER, PQFP64
封装: GREEN, PLASTIC, HTQFP-64
文件页数: 17/34页
文件大小: 1823K
代理商: TAS5631PHD
SLES221C – JULY 2009 – REVISED APRIL 2010
www.ti.com
PRINTED CIRCUIT BOARD RECOMMENDATION
Use an unbroken ground plane to have good low-impedance and -inductance return path to the power supply for
power and audio signals. PCB layout, audio performance and EMI are linked closely together. The circuit
contains high, fast-switching currents; therefore, care must be taken to prevent damaging voltage spikes. Routing
for the audio input should be kept short and together with the accompanying audio source ground. It is important
to keep a solid local ground area underneath the device to minimize ground bounce.
Netlist for this printed circuit board is generated from the schematic in Figure 14.
Note T1: PVDD decoupling bulk capacitors C60–C64 should be as close as possible to the PVDD and GND_X pins;
the heat sink sets the distance. Wide traces should be routed on the top layer with direct connection to the pins and
without going through vias. No vias or traces should be blocking the current path.
Note T2: Close decoupling of PVDD with low-impedance X7R ceramic capacitors is placed under the heat sink and
close to the pins.
Note T3: Heat sink must have a good connection to PCB ground.
Note T4: Output filter capacitors must be linear in the applied voltage range, and preferably metal film types.
Figure 19. Printed Circuit Board – Top Layer
24
Copyright 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TAS5631
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