参数资料
| 型号： | TBU-PL085-100-WH |
| 厂商： | Bourns Inc. |
| 文件页数： | 5/7页 |
| 文件大小： | 0K |
| 描述： | SURGE SUPP TBU DL 50OHM 850VIMP |
| 标准包装： | 1 |
| 系列： | TBU™ |
| 电压 - 工作： | 425V |
| 电压 - 箝位： | 850V |
| 技术： | 混合技术 |
| 电路数： | 2 |
| 应用： | SLIC |
| 封装/外壳： | SMD 6.50mm x 4.00mm |
| 供应商设备封装： | SMD |
| 包装： | 标准包装 |
| 其它名称： | TBU-PL085-100-WHDKR |
TBU-PL Series - TBU ? High-Speed Protectors
Product Dimensions
0.70
(.028)
0.825
(.032)
0.40
(.016)
0.825
(.032)
0.725
(.029)
1.275
(.050)
0.30
(.012)
6.50
(.256)
0.85 ± 0.05
(.033 ± .002)
1.335
0.30
(.012)
1.15
(.045)
1.20
(.047)
1.35
(.053)
1.275
(.053)
(.050)
0.73
(.029)
0.85
(.033)
0.85
(.033)
4.00
(.157)
1.335
1.35
(.053)
0.85
(.033)
1.20
(.047)
0.85
(.033)
1.275
(.010)
PIN 1 & BACKSIDE CHAMFER
0.80 - 0.95
(.031 - .037)
(.053)
1.25
(.049)
0.75
(.050)
0.25
C PIN 1
0.90
(.030)
0.70
(.028)
1.30
(.051)
0.85
(.033)
0.85
(.033)
(.035)
0.00 - 0.05
(.000 - .002)
DIMENSIONS:
MM
(INCHES)
0.75
(.030)
0.40
(.016)
0.75
(.030)
Recommended Pad Layout
TBU ? High-Speed Protectors have a 100 % matte-tin termination
?nish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be de?ned by a solder mask
which matches the pad layout of the TBU ? device in size and spac-
ing. It is recommended that they should be the same dimension as
the TBU ? pads but if smaller solder pads are used, they should be
centered on the TBU ? package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU ? pad sizes
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad
size. Extended copper areas beyond the solder pad signi?cantly
improve the junction to ambient thermal resistance, resulting in
operation at lower junction temperatures with a corresponding
bene?t of reliability. All pads should soldered to the PCB, includ-
ing pads marked as NC or NU but no electrical connection should
be made to these pads. For minimum parasitic capacitance, it is
recommended that signal, ground or power signals are not routed
beneath any pad.
to ensure adequate clearance is maintained. The recommended
Thermal Resistance vs Additional PCB Cu Area
120
4
5
3
6
2
7
1
8
100
80
Power in One Side of TBU ? Device
Total Power in Both Sides of TBU ? Device
60
40
Dark grey areas show added PCB copper area for better
thermal resistance.
20
0
Speci?cations are subject to change without notice.
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Customers should verify actual device performance in their speci?c applications.
Added Cu Area (Sq. In.)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TBU-PL085-100-WH | 制造商:Bourns Inc 功能描述:Transient Blocking Unit |
| TBU-PL085-200-WH | 功能描述:浪涌抑制器 Dual 50ohm TBU Devce Bi-directional RoHS:否 制造商:Bourns 电压额定值:40 V 电流额定值:750 mA 工作温度范围:- 40 C to + 125 C 端接类型:SMD/SMT 封装 / 箱体: |
| TBU-PL085-200-WH | 制造商:Bourns Inc 功能描述:Transient Blocking Unit |
| TBV-100M-2A-3026 | 制造商:SUPERWORLD 制造商全称:Superworld Electronics 功能描述:TOROIDAL INDUCTOR |
| TBV-101M-2A-5026 | 制造商:SUPERWORLD 制造商全称:Superworld Electronics 功能描述:TOROIDAL INDUCTOR |
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