参数资料
| 型号： | TC1174VUATR |
| 厂商： | Microchip Technology |
| 文件页数： | 2/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .3A 8MSOP |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 2.7 V ~ 6 V |
| 电压 - 压降（标准）： | 0.27V @ 300mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 300mA（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 带卷 (TR) |
TC1174
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (V SS – 0.3V) to (V IN + 0.3V)
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Power Dissipation................Internally Limited (Note 5)
Maximum Voltage on Any Pin ........ V IN +0.3V to -0.3V
Operating Temperature Range...... -40°C < T J < 125°C
Storage Temperature.......................... -65°C to +150°C
TC1174 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V IN = V OUT + 1V, I L = 0.1 μ A, C L = 3.3 μ F, SHDN > V IH , T A = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
V IN
I OUT MAX
V REF
? V OUT / ? T
? V OUT / ? V IN
? V OUT /V OUT
V IN -V OUT
Parameter
Input Operating Voltage
Maximum Output Current
Reference Voltage
V OUT Temperature Coefficient
Line Regulation
Load Regulation
Dropout Voltage
Min
2.7
300
1.165
—
—
—
—
Typ
—
—
1.20
40
0.05
1.1
20
Max
6.0
—
1.235
—
0.35
2.0
30
Units
V
mA
V
ppm/°C
%
%
mV
Test Conditions
Note 6
Note 1
(V R + 1V) ≤ V IN ≤ 6V
I L = 0.1mA to I OUT MAX (Note 2)
I L = 0.1mA
—
—
80
270
160
480
I L = 100mA
I L = 300mA (Note 3)
I SS1
I SS2
PSRR
I OUT SC
? V OUT / ? P D
eN
Supply Current
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
Output Noise
—
—
—
—
—
—
50
0.05
60
550
0.04
260
90
0.5
—
650
—
—
μ A
μ A
dB
mA
V/W
nV/ √ Hz
SHDN = V IH
SHDN = 0V
F RE – 1kHz
V OUT = 0V
Note 4
F = 10kHz, I L = I OUT MAX
470pF from Bypass to GND
SHDN Input
V IH
V IL
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
—
15
%V IN
%V IN
ADJ Input
I ADJ
Adjustable Input Leakage Current
—
50
—
pA
1:
2:
3:
4:
5:
6:
TC V OUT = ( V OUT MAX – V OUT MIN ) x 10 6
V OUT x ? T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I L MAX at V IN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T A , T J , θ JA ). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
The minimum V IN has to justify the conditions: V IN ≥ V R + V DROPOUT and V IN ≥ 2.7V for I L = 0.1mA to I OUT MAX .
DS21363B-page 2
2002 Microchip Technology Inc.
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