参数资料
| 型号： | TC1174VUATR |
| 厂商： | Microchip Technology |
| 文件页数： | 5/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .3A 8MSOP |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 2.7 V ~ 6 V |
| 电压 - 压降（标准）： | 0.27V @ 300mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 300mA（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 带卷 (TR) |
TC1174
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
EQUATION 4-2:
P D MAX = ( T J MAX – T A MAX )
θ JA
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
Where all terms are previously defined.
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
4.2
Power Dissipation
limits. For example:
Given:
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
V IN MAX = 3.0V + 10%
V OUT MIN = 2.7V – 0.5%
I LOAD MAX = 250mA
T J MAX
= 125°C
EQUATION 4-1:
T A MAX
= 55°C
P D ≈ (V IN MAX – V OUT MIN )I LOAD MAX
8-Pin MSOP Package
Where:
P D
V IN MAX
V OUT MIN
I LOAD MAX
= Worst case actual power dissipation
= Maximum voltage on V IN
= Minimum regulator output voltage
= Maximum output (load) current
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P D ≈ (V IN MAX – V OUT MIN )I LOAD MAX
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10 –3
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T A MAX ), the maximum allowable die temperature
(T J MAX ) and the thermal resistance from junction-to-air
( θ JA ). The 8-Pin SOIC package has a θ JA of approxi-
mately 160°C/Watt, while the 8-Pin MSOP package
has a θ JA of approximately 200°C/Watt.
= 155mW
Maximum allowable power dissipation:
P D MAX = (T J MAX – T A MAX )
θ JA
= (125 – 55 )
200
= 350mW
In this example, the TC1174 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V IN is found by substituting the maximum allowable
power dissipation of 350mW into Equation 4-1, from
which V IN MAX = 4.1V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θ JA and therefore
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21363B-page 5
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