参数资料
型号: TC4427COA713
厂商: Microchip Technology
文件页数: 9/20页
文件大小: 0K
描述: IC MOSFET DVR 1.5A DUAL HS 8SOIC
标准包装: 1
配置: 低端
输入类型: 非反相
延迟时间: 20ns
电流 - 峰: 1.5A
配置数: 2
输出数: 2
电源电压: 4.5 V ~ 18 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 标准包装
产品目录页面: 671 (CN2011-ZH PDF)
其它名称: TC4427COA713DKR
TC4426/TC4427/TC4428
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE (1)
8-Pin PDIP/
MSOP/SOIC
1
2
3
4
5
6
7
8
8-Pin
DFN
1
2
3
4
5
6
7
8
PAD
Symbol
NC
IN A
GND
IN B
OUT B
V DD
OUT A
NC
NC
No connection
Input A
Ground
Input B
Output B
Supply input
Output A
No connection
Exposed Metal Pad
Description
Note 1:
Duplicate pins must be connected for proper operation.
3.1
Inputs A and B
3.4
Supply Input (V DD )
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
The V DD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the ground
pin. The V DD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven. A value of 1.0 μ F is suggested.
3.2
Ground (GND)
Ground is the device return pin. The ground pin(s)
3.5
Exposed Metal Pad
should have a low-impedance connection to the bias
supply source return. High peak currents will flow out
the ground pin(s) when the capacitive load is being
discharged.
The exposed metal pad of the 6x5 DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board, to aid in heat
removal from the package.
3.3
Output A and B
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and pull-
up devices are of equal strength, making the rise and
fall times equivalent.
? 2006 Microchip Technology Inc.
DS21422D-page 9
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