参数资料
型号: TC7652CPA
厂商: Microchip Technology
文件页数: 14/16页
文件大小: 0K
描述: IC OPAMP CHOPPER STAB LN 8DIP
标准包装: 60
放大器类型: 断路器(零漂移)
电路数: 1
转换速率: 1 V/µs
增益带宽积: 400kHz
电流 - 输入偏压: 30pA
电压 - 输入偏移: 2000µV
电流 - 电源: 1mA
电压 - 电源,单路/双路(±): 5 V ~ 16 V,±2.5 V ~ 8 V
工作温度: 0°C ~ 70°C
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-PDIP
包装: 管件
产品目录页面: 680 (CN2011-ZH PDF)
其它名称: 158-1136
158-1136-ND
2002 Microchip Technology Inc.
DS21464B-page 7
TC7652
4.3
Output Stage/Load Driving
The output circuit is high impedance (about 18k
).
With lesser loads, the chopper amplifier behaves
somewhat like a transconductance amplifier with an
open-loop gain proportional to load resistance. (For
example, the open-loop gain is 17dB lower with a 1k
.
load than with a 10k
load.) If the amp is used only for
DC, the DC gain is typically greater than 120dB (even
witha1k
load), and this lower gain is inconsequential.
For wide band, the best frequency response occurs
with a load resistor of at least 10k
. This produces a
6dB/octave response from 0.1Hz to 2MHz, with phase
shifts of less than 2 degrees in the transition region,
where the main amplifier takes over from the null ampli-
fier.
FIGURE 4-1:
CONNECTION OF INPUT GUARDS
4.4
Thermoelectric Effects
The thermoelectric (Seebeck) effects in thermocouple
junctions of dissimilar metals, alloys, silicon, etc. limit
ultra high precision DC amplifiers. Unless all junctions
are at the same temperature, thermoelectric voltages
around 0.1
V/°C (up to tens of V/°C for some materi-
als) are generated. To realize the low offset voltages of
the chopper, avoid temperature gradients. Enclose
components to eliminate air movement, especially from
power dissipating elements in the system. Where pos-
sible, use low thermoelectric co-efficient connections.
Keep power supply voltages and power dissipation to a
minimum. Use high impedance loads and seek maxi-
mum separation from surrounding heat disipating ele-
ments.
4.5
Guarding
To benefit from TC7652 low input currents, take care
assembling printed circuit boards. Clean boards with
alcohol or TCE and blow dry with compressed air. To
prevent contamination, coat boards with epoxy or sili-
cone rubber.
Even if boards are cleaned and coated, leakage cur-
rents may occur because input pins are next to pins at
supply potentials. To reduce this leakage, use guarding
to lower the voltage difference between the inputs and
adjacent metal runs. The guard (a conductive ring sur-
rounding inputs) is connected to a low impedance point
at about the same voltage as inputs. The guard
absorbs leakage currents from high voltage pins.
The 14-pin dual-in-line arrangement simplifies guard-
ing. Like the LM108 pin configuration (but unlike the
101A and 741), pins next to inputs are not used.
Input
+
Output
R2
R1
Inverting Amplifier
Input
+
Output
Follower
Input
+
Output
R2
R1
Noninverting Amplifier
TC7652
-
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