参数资料
型号: TDA10023HT
厂商: NXP SEMICONDUCTORS
元件分类: 消费家电
英文描述: SPECIALTY CONSUMER CIRCUIT, PQFP64
封装: 10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, SOT-357-1, TQFP-64
文件页数: 9/20页
文件大小: 101K
代理商: TDA10023HT
9397 750 14559
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 12 April 2005
17 of 20
Philips Semiconductors
TDA10023HT
Single chip DVB-C/MCNS channel receiver
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
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