- 您现在的位置：买卖IC网 > PDF目录98191 > TDA4866J (NXP SEMICONDUCTORS) VERTICAL DEFLECTION IC, PZIP9 PDF资料下载
参数资料
| 型号： | TDA4866J |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 偏转 |
| 英文描述： | VERTICAL DEFLECTION IC, PZIP9 |
| 封装： | POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN |
| 文件页数： | 7/20页 |
| 文件大小： | 108K |
| 代理商： | TDA4866J |
2001 Aug 07
15
Philips Semiconductors
Product specication
Full bridge current driven vertical deection
booster
TDA4866
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our
“Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable(1)
相关PDF资料 |
PDF描述 |
|---|---|
| TDA4882N | SPECIALTY CONSUMER CIRCUIT, PDIP20 |
| TDA4884N | 3 CHANNEL, VIDEO PREAMPLIFIER, PDIP20 |
| TDA4885N | SPECIALTY CONSUMER CIRCUIT, PDIP32 |
| TDA5140AT-T | BRUSHLESS DC MOTOR CONTROLLER, 1 A, PDSO20 |
| TDA5149A-T | BRUSHLESS DC MOTOR CONTROLLER, 2.5 A, PQFP64 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA4867 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Full bridge current driven vertical deflection booster |
| TDA4867J | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Full bridge current driven vertical deflection booster |
| TDA4881 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Advanced monitor video controller |
| TDA4881N | 制造商:NXP Semiconductors 功能描述: |
| TDA4882 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Advanced monitor video controller for OSD |
发布紧急采购，3分钟左右您将得到回复。