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参数资料
| 型号： | TDA6405ATS/C1 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 调谐器 |
| 英文描述： | VIDEO TUNER, PDSO28 |
| 封装： | PLASTIC, SOT-341, SSOP-28 |
| 文件页数： | 21/35页 |
| 文件大小： | 262K |
| 代理商： | TDA6405ATS/C1 |
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1999 Jan 13
28
Philips Semiconductors
Product specication
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
TDA6404; TDA6405;
TDA6405A
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| TDA6405TS/C1 | VIDEO TUNER, PDSO28 |
| TDA6405TS/C2 | VIDEO TUNER, PDSO28 |
| TDA4854/V2 | HORIZ/VERT DEFLECTION IC, PDIP32 |
| TDA4854NB | HORIZ/VERT DEFLECTION IC, PDIP32 |
| TDA7052A/N2 | 1 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDIP8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA6405TS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator-PLL synthesizers for hyperband tuners |
| TDA6500 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and synthesizer for PAL and NTSC standards |
| TDA6500TT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and synthesizer for PAL and NTSC standards |
| TDA6500TT/C4,118 | 功能描述:IC MIXER/OSC SYNTH 32TSSOP RoHS:是 类别:集成电路 (IC) >> 线性 - 视频处理 系列:- 产品变化通告:Product Discontinuation 07/Mar/2011 标准包装:3,000 系列:OMNITUNE™ 类型:调谐器 应用:移动电话，手机，视频显示器 安装类型:表面贴装 封装/外壳:65-WFBGA 供应商设备封装:PG-WFSGA-65 包装:带卷 (TR) 其它名称:SP000365064 |
| TDA6501 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V mixer/oscillator and synthesizer for PAL and NTSC standards |
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