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参数资料
| 型号： | TDA7000 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 接收器 |
| 英文描述： | FM radio circuit(FM收音电路) |
| 中文描述： | FM, AUDIO SINGLE CHIP RECEIVER, PDIP18 |
| 封装： | PLASTIC, DIP-18 |
| 文件页数： | 2/10页 |
| 文件大小： | 224K |
| 代理商： | TDA7000 |
May 1992
10
Philips Semiconductors
Product specication
FM radio circuit
TDA7000
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specication
This data sheet contains target or goal specications for product development.
Preliminary specication
This data sheet contains preliminary data; supplementary data may be published later.
Product specication
This data sheet contains nal product specications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specication
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specication.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA7010 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:FM radio circuit |
| TDA7010T | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:FM radio circuit |
| TDA7010T/V3 | 制造商:NXP Semiconductors 功能描述:FM RADIO CIRCUIT SMD 7010 SOIC16 |
| TDA7010T/V3 | 制造商:NXP Semiconductors 功能描述:FM RADIO CIRCUIT SMD 7010 SOIC16 |
| TDA7010T3AA | 功能描述:IC FM RADIO 16-SOIC RoHS:是 类别:RF/IF 和 RFID >> RF 接收器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 09/Jan/2012 标准包装:50 系列:* 频率:850MHz ~ 2.175GHz 灵敏度:- 数据传输率 - 最大:- 调制或协议:- 应用:* 电流 - 接收:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 特点:- 电源电压:4.75 V ~ 5.25 V 工作温度:0°C ~ 85°C 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（6x6） 包装:托盘 |
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