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参数资料
| 型号： | TDA8768H/5/C1 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | ADC |
| 英文描述： | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44 |
| 封装： | PLASTIC, SOT-307-2, QFP-44 |
| 文件页数： | 8/23页 |
| 文件大小： | 183K |
| 代理商： | TDA8768H/5/C1 |
1998 Aug 26
16
Philips Semiconductors
Preliminary specication
12-bit high-speed Analog-to-Digital
Converter (ADC)
TDA8768
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Reow soldering
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For details,
refer to the Drypack information in the
“Data Handbook
IC26; Integrated Circuit Packages; Section: Packing
Methods”.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250
°C.
Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
CAUTION
Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.
If wave soldering cannot be avoided, for QFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°C within
6 seconds. Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°C.
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| TDA8768H/5B-T | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44 |
| TDA8768H/5B | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA8769 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:12-bit, 60/80/105 Msps Analog-to-Digital Converter (ADC) Nyquist/high IF sampling |
| TDA8771 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Video DAC without Color Palette |
| TDA8771A | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Triple 8-bit video Digital-to-Analog Converter DAC |
| TDA8771AH | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Triple 8-bit video Digital-to-Analog Converter DAC |
| TDA8771AH/C1,551 | 功能描述:数模转换器- DAC TRIPLE 8-BIT VIDEO D-TO-A CONV RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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