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参数资料
| 型号： | TDA8920TH/N1,118 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 80 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| 封装： | PLASTIC, SOT-566-3, HSOP-24 |
| 文件页数： | 27/36页 |
| 文件大小： | 733K |
| 代理商： | TDA8920TH/N1,118 |
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2002 Sep 25
33
Philips Semiconductors
Product specication
2
× 80 W class-D power amplier
TDA8920
18.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| TDA8924TH/N2,518 | 120 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| TDA8926TH | 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| TDA8929T/N1,118 | 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
| TDA8932TW | 25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| TDA8933BTW/N2,512 | 20.6 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA8922 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 x 25 W class-D power amplifier |
| TDA8922B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 X 50 W class-D power amplifier |
| TDA8922BJ | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 X 50 W class-D power amplifier |
| TDA8922BJ/N2,112 | 功能描述:音频放大器 2X50W CLASSD PWR AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDA8922BTH | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2 X 50 W class-D power amplifier |
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